Numerical simulation of heat transfer enhancement for copper foam heat sink in electronic devices using water based BN nanofluids

G. Zhang, H. Cao, M.E. Navarro, J.W. Pomeroy, C. Yuan, M. Kuball, Y. Ding

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Original languageEnglish
Title of host publicationInternational Heat Transfer Conference
Publication statusPublished - 2018

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