Numerical simulation of heat transfer enhancement for copper foam heat sink in electronic devices using water based BN nanofluids

G. Zhang, H. Cao, M.E. Navarro, J.W. Pomeroy, C. Yuan, M. Kuball, Y. Ding

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Original language	English
Title of host publication	International Heat Transfer Conference
Publication status	Published - 2018

Cite this

@inproceedings{3ac1b164f9724c6299d53878deed8d2f,

title = "Numerical simulation of heat transfer enhancement for copper foam heat sink in electronic devices using water based BN nanofluids",

author = "G. Zhang and H. Cao and M.E. Navarro and J.W. Pomeroy and C. Yuan and M. Kuball and Y. Ding",

year = "2018",

language = "English",

booktitle = "International Heat Transfer Conference",

}

TY - GEN

T1 - Numerical simulation of heat transfer enhancement for copper foam heat sink in electronic devices using water based BN nanofluids

AU - Zhang, G.

AU - Cao, H.

AU - Navarro, M.E.

AU - Pomeroy, J.W.

AU - Yuan, C.

AU - Kuball, M.

AU - Ding, Y.

PY - 2018

Y1 - 2018

UR - http://www.scopus.com/inward/record.url?eid=2-s2.0-85068333418&partnerID=MN8TOARS

M3 - Conference contribution

BT - International Heat Transfer Conference

ER -