Original language | English |
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Title of host publication | 2011 IEEE 13th Electronics Packaging Technology Conference, EPTC 2011 |
DOIs | |
Publication status | Published - 2011 |
Novel dual layer electroformed stencils for high resolution LTCC circuit manufacture
R.W. Kay, G. Cummins, M.P.Y. Desmulliez, J. Terry, A.J. Walton
Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
2
Citations
(Scopus)