Measurement and optimisation of bond strength for anodic bonding of glass to dielectric thin films

G. Cummins, H. Lin, A. J. Walton

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

2 Citations (Scopus)

Original language	English
Title of host publication	2008 IEEE International Conference on Microelectronic Test Structures
DOIs	https://doi.org/10.1109/ICMTS.2008.4509324
Publication status	Published - 2008

Name	2008 Ieee International Conference on Microelectronic Test Structures, Conference Proceedings

Access to Document

@inproceedings{8079087ef09448339baf96374de007c6,

title = "Measurement and optimisation of bond strength for anodic bonding of glass to dielectric thin films",

author = "G. Cummins and H. Lin and Walton, {A. J.}",

year = "2008",

doi = "10.1109/ICMTS.2008.4509324",

language = "English",

series = "2008 Ieee International Conference on Microelectronic Test Structures, Conference Proceedings",

booktitle = "2008 IEEE International Conference on Microelectronic Test Structures",

}

Measurement and optimisation of bond strength for anodic bonding of glass to dielectric thin films. / Cummins, G.; Lin, H.; Walton, A. J.
2008 IEEE International Conference on Microelectronic Test Structures. 2008. (2008 Ieee International Conference on Microelectronic Test Structures, Conference Proceedings).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

TY - GEN

T1 - Measurement and optimisation of bond strength for anodic bonding of glass to dielectric thin films

AU - Cummins, G.

AU - Lin, H.

AU - Walton, A. J.

PY - 2008

Y1 - 2008

U2 - 10.1109/ICMTS.2008.4509324

DO - 10.1109/ICMTS.2008.4509324

M3 - Conference contribution

T3 - 2008 Ieee International Conference on Microelectronic Test Structures, Conference Proceedings

BT - 2008 IEEE International Conference on Microelectronic Test Structures

ER -