Backscattered Electron Imaging and Electron Backscattered Diffraction in the Study of Bacterial Attachment to Titanium Alloy Structure

Anqi Wang; Ian Jones; Junfa Mei; Yau Yau Tse; Gabriel Landini; Yue Li; Linnan Ke; Yuanli Huang; Li Liu; Chunren Wang; Rachel Sammons

doi:10.1111/jmi.12649

Backscattered Electron Imaging and Electron Backscattered Diffraction in the Study of Bacterial Attachment to Titanium Alloy Structure

Anqi Wang, Ian Jones, Junfa Mei, Yau Yau Tse, Gabriel Landini, Yue Li, Linnan Ke, Yuanli Huang, Li Liu, Chunren Wang, Rachel Sammons

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Abstract

The application of secondary electron (SE) imaging, backscattered electron imaging (BSE) and electron backscattered diffraction (EBSD) was investigated in this work to study the bacterial adhesion and proliferation on a commercially pure titanium (cp Ti) and a Ti6Al4V alloy (Ti 64) with respect to substrate microstructure and chemical composition. Adherence of Gram-positive Staphylococcus epidermidis 11047 and Streptococcus sanguinis GW2, and Gram-negative Serratia sp. NCIMB 40259 and Escherichia coli 10418 was compared on cp Ti, Ti 64, pure aluminium (Al) and vanadium (V). The substrate microstructure and the bacterial distribution on these metals were characterised using SE, BSE and EBSD imaging. It was observed that titanium alloy-phase structure, grain boundaries and grain orientation did not influence bacterial adherence or proliferation at microscale. Adherence of all four strains was similar on cp Ti and Ti 64 surfaces whilst inhibited on pure Al. This work establishes a nondestructive and straight-forward statistical method to analyse the relationship between microbial distribution and metal alloy structure.

Original language	English
Journal	Journal of Microscopy
Early online date	11 Oct 2017
DOIs	https://doi.org/10.1111/jmi.12649
Publication status	E-pub ahead of print - 11 Oct 2017

Keywords

electron microscopy
bacteria adhesion
grain boundary
grain orientation
chemical composition
microstructure

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Wang_et_al_Backscattered_electron_imaging_Journal_of_Microscopy_2017
This is the peer reviewed version of the following article: WANG, A., JONES, I. P., LANDINI, G., MEI, J., TSE, Y. Y., LI, Y. X., KE, L., HUANG, Y., LIU, L., WANG, C. and SAMMONS, R. L. (2017), Backscattered electron imaging and electron backscattered diffraction in the study of bacterial attachment to titanium alloy structure. Journal of Microscopy. doi:10.1111/jmi.12649, which has been published in final form at [Link to final article using the 10.1111/jmi.12649. This article may be used for non-commercial purposes in accordance with Wiley Terms and Conditions for Self-Archiving.
Accepted author manuscript, 2.82 MB

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title = "Backscattered Electron Imaging and Electron Backscattered Diffraction in the Study of Bacterial Attachment to Titanium Alloy Structure",

abstract = "The application of secondary electron (SE) imaging, backscattered electron imaging (BSE) and electron backscattered diffraction (EBSD) was investigated in this work to study the bacterial adhesion and proliferation on a commercially pure titanium (cp Ti) and a Ti6Al4V alloy (Ti 64) with respect to substrate microstructure and chemical composition. Adherence of Gram-positive Staphylococcus epidermidis 11047 and Streptococcus sanguinis GW2, and Gram-negative Serratia sp. NCIMB 40259 and Escherichia coli 10418 was compared on cp Ti, Ti 64, pure aluminium (Al) and vanadium (V). The substrate microstructure and the bacterial distribution on these metals were characterised using SE, BSE and EBSD imaging. It was observed that titanium alloy-phase structure, grain boundaries and grain orientation did not influence bacterial adherence or proliferation at microscale. Adherence of all four strains was similar on cp Ti and Ti 64 surfaces whilst inhibited on pure Al. This work establishes a nondestructive and straight-forward statistical method to analyse the relationship between microbial distribution and metal alloy structure.",

keywords = "electron microscopy , bacteria adhesion , grain boundary , grain orientation , chemical composition , microstructure",

author = "Anqi Wang and Ian Jones and Junfa Mei and Tse, {Yau Yau} and Gabriel Landini and Yue Li and Linnan Ke and Yuanli Huang and Li Liu and Chunren Wang and Rachel Sammons",

year = "2017",

month = oct,

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doi = "10.1111/jmi.12649",

language = "English",

journal = "Journal of Microscopy",

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T1 - Backscattered Electron Imaging and Electron Backscattered Diffraction in the Study of Bacterial Attachment to Titanium Alloy Structure

AU - Wang, Anqi

AU - Jones, Ian

AU - Mei, Junfa

AU - Tse, Yau Yau

AU - Landini, Gabriel

AU - Li, Yue

AU - Ke, Linnan

AU - Huang, Yuanli

AU - Liu, Li

AU - Wang, Chunren

AU - Sammons, Rachel

PY - 2017/10/11

Y1 - 2017/10/11

N2 - The application of secondary electron (SE) imaging, backscattered electron imaging (BSE) and electron backscattered diffraction (EBSD) was investigated in this work to study the bacterial adhesion and proliferation on a commercially pure titanium (cp Ti) and a Ti6Al4V alloy (Ti 64) with respect to substrate microstructure and chemical composition. Adherence of Gram-positive Staphylococcus epidermidis 11047 and Streptococcus sanguinis GW2, and Gram-negative Serratia sp. NCIMB 40259 and Escherichia coli 10418 was compared on cp Ti, Ti 64, pure aluminium (Al) and vanadium (V). The substrate microstructure and the bacterial distribution on these metals were characterised using SE, BSE and EBSD imaging. It was observed that titanium alloy-phase structure, grain boundaries and grain orientation did not influence bacterial adherence or proliferation at microscale. Adherence of all four strains was similar on cp Ti and Ti 64 surfaces whilst inhibited on pure Al. This work establishes a nondestructive and straight-forward statistical method to analyse the relationship between microbial distribution and metal alloy structure.

AB - The application of secondary electron (SE) imaging, backscattered electron imaging (BSE) and electron backscattered diffraction (EBSD) was investigated in this work to study the bacterial adhesion and proliferation on a commercially pure titanium (cp Ti) and a Ti6Al4V alloy (Ti 64) with respect to substrate microstructure and chemical composition. Adherence of Gram-positive Staphylococcus epidermidis 11047 and Streptococcus sanguinis GW2, and Gram-negative Serratia sp. NCIMB 40259 and Escherichia coli 10418 was compared on cp Ti, Ti 64, pure aluminium (Al) and vanadium (V). The substrate microstructure and the bacterial distribution on these metals were characterised using SE, BSE and EBSD imaging. It was observed that titanium alloy-phase structure, grain boundaries and grain orientation did not influence bacterial adherence or proliferation at microscale. Adherence of all four strains was similar on cp Ti and Ti 64 surfaces whilst inhibited on pure Al. This work establishes a nondestructive and straight-forward statistical method to analyse the relationship between microbial distribution and metal alloy structure.

KW - electron microscopy

KW - bacteria adhesion

KW - grain boundary

KW - grain orientation

KW - chemical composition

KW - microstructure

U2 - 10.1111/jmi.12649

DO - 10.1111/jmi.12649

M3 - Article

SN - 0022-2720

JO - Journal of Microscopy

JF - Journal of Microscopy

ER -

Backscattered Electron Imaging and Electron Backscattered Diffraction in the Study of Bacterial Attachment to Titanium Alloy Structure

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Keywords

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