@inproceedings{ff237a1d7a7a4dca9a947ab6c17ecfc4,
title = "An alternative non-contact planarization technique by utilizing the electrokinetic phenomenon",
abstract = "In this paper, the authors introduce and present some findings on an alternative non-contact material removal technique. Material removal is made possible by utilizing the electrokinetic and hydrodynamic effects of suspended particles to manipulate their trajectories to impact onto the surface of the workpiece. The research was previously demonstrated and reported where the removal rate can be precisely controlled by varying the electrical field and the flow rate of the slurry across the surface of the workpiece. New findings are reported on the application of the technique to different materials that will highlight the attractiveness of this alternative approach to Producing surface with roughnness in the order of nanometres",
author = "Leo, {C. S.} and Ng, {S. H.} and Butler, {D. L.} and S. Danyluk",
year = "2010",
language = "English",
isbn = "9781605112268",
series = "Materials Research Society Symposium Proceedings",
pages = "141--146",
booktitle = "Advanced Interconnects and Chemical Mechanical Planarization for Micro- and Nanoelectronics",
note = "2010 MRS Spring Meeting ; Conference date: 05-04-2010 Through 09-04-2010",
}