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Abstract
This paper presents a monolithic 3D printed twisted waveguide bandpass filter. The component integrates filtering and polarization rotation functionalities. It operates with a center frequency of 60 GHz and a fractional bandwidth (FBW) of 5%. The filter was made from stainless steel using micro laser sintering (MLS) process. It was designed and printed in such a way that no internal support structures are required. The measured response of the as-printed filter showed a very decent frequency response with a minimum insertion loss of 1.3 dB and a return loss better than 18.7 dB without any tuning. The filter was then gold coated using electroless process which significantly improved the insertion loss to a minimum of 0.3 dB. The results demonstrate the capability of the high-precision 3D metal printing technology in fabricating complex geometries that are challenging using conventional milling techniques, as well as an effective plating technique.
Original language | English |
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Title of host publication | 2023 53rd European Microwave Conference, EuMC 2023 |
Publisher | IEEE |
Pages | 231-234 |
Number of pages | 4 |
ISBN (Electronic) | 9782874870729 |
ISBN (Print) | 9798350347395 |
DOIs | |
Publication status | Published - 30 Oct 2023 |
Event | 53rd European Microwave Conference, EuMC 2023 - Berlin, Germany Duration: 19 Sept 2023 → 21 Sept 2023 |
Publication series
Name | European Conference on Microwave |
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Publisher | IEEE |
Conference
Conference | 53rd European Microwave Conference, EuMC 2023 |
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Country/Territory | Germany |
City | Berlin |
Period | 19/09/23 → 21/09/23 |
Bibliographical note
Publisher Copyright:© 2023 European Microwave Association (EuMA).
ASJC Scopus subject areas
- Computer Networks and Communications
- Electrical and Electronic Engineering
- Electronic, Optical and Magnetic Materials
- Instrumentation
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Dive into the research topics of 'A 3D Printed V-Band Twisted Monolithic Waveguide Bandpass Filter'. Together they form a unique fingerprint.Projects
- 1 Finished
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Towards a 3D Printed Terahertz Circuit Technology
Wang, Y. (Co-Investigator) & Lancaster, M. (Principal Investigator)
Engineering & Physical Science Research Council
1/07/19 → 30/04/23
Project: Research Councils