Project Details
Short title | Ceramic Interface Laser Machining System for 3D wafer bump |
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Status | Finished |
Effective start/end date | 1/11/15 → 31/10/18 |
Funding
- SDA CO LTD
Short title | Ceramic Interface Laser Machining System for 3D wafer bump |
---|---|
Status | Finished |
Effective start/end date | 1/11/15 → 31/10/18 |