Thick photoresists for electroforming metallic microcomponents

Xueyong Wei; CH Lee; Z Jiang; Kyle Jiang

doi:10.1243/09544062jmes786

Thick photoresists for electroforming metallic microcomponents

Xueyong Wei, CH Lee, Z Jiang, Kyle Jiang

Mechanical Engineering

Research output: Contribution to journal › Article

9 Citations (Scopus)

Abstract

Recently, microelectroforming has been extensively applied to fabricating metallic components for sensors, actuators, and other systems. Thick photoresists are used for making micromoulds for electroforming and closely related to the quality and costs of an electroforming process. In the current paper, thick UV photoresists SU8, BPR100, and KMPR are analysed and compared in their electroforming performance of nickel microcomponents. Optimized UV lithography processes are introduced for producing micromoulds in each of the resists and scanning electron microscope (SEM) images of the moulds are presented and analysed. Then, electroformed nickel components from the micromoulds are presented. Finally, applicability of the photoresists to electroforming microcomponents is discussed. Each of the resists demonstrates advantages and disadvantages to suit different applications.

Original language	English
Pages (from-to)	37-42
Number of pages	6
Journal	Institution of Mechanical Engineers. Proceedings. Part C: Journal of Mechanical Engineering Science
Volume	222
Issue number	1
DOIs	https://doi.org/10.1243/09544062jmes786
Publication status	Published - 1 Jan 2008

Keywords

micromoulds
microelectroforming
SU8
KMPR
BPR100

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10.1243/09544062jmes786

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abstract = "Recently, microelectroforming has been extensively applied to fabricating metallic components for sensors, actuators, and other systems. Thick photoresists are used for making micromoulds for electroforming and closely related to the quality and costs of an electroforming process. In the current paper, thick UV photoresists SU8, BPR100, and KMPR are analysed and compared in their electroforming performance of nickel microcomponents. Optimized UV lithography processes are introduced for producing micromoulds in each of the resists and scanning electron microscope (SEM) images of the moulds are presented and analysed. Then, electroformed nickel components from the micromoulds are presented. Finally, applicability of the photoresists to electroforming microcomponents is discussed. Each of the resists demonstrates advantages and disadvantages to suit different applications.",

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T1 - Thick photoresists for electroforming metallic microcomponents

AU - Wei, Xueyong

AU - Lee, CH

AU - Jiang, Z

AU - Jiang, Kyle

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N2 - Recently, microelectroforming has been extensively applied to fabricating metallic components for sensors, actuators, and other systems. Thick photoresists are used for making micromoulds for electroforming and closely related to the quality and costs of an electroforming process. In the current paper, thick UV photoresists SU8, BPR100, and KMPR are analysed and compared in their electroforming performance of nickel microcomponents. Optimized UV lithography processes are introduced for producing micromoulds in each of the resists and scanning electron microscope (SEM) images of the moulds are presented and analysed. Then, electroformed nickel components from the micromoulds are presented. Finally, applicability of the photoresists to electroforming microcomponents is discussed. Each of the resists demonstrates advantages and disadvantages to suit different applications.

AB - Recently, microelectroforming has been extensively applied to fabricating metallic components for sensors, actuators, and other systems. Thick photoresists are used for making micromoulds for electroforming and closely related to the quality and costs of an electroforming process. In the current paper, thick UV photoresists SU8, BPR100, and KMPR are analysed and compared in their electroforming performance of nickel microcomponents. Optimized UV lithography processes are introduced for producing micromoulds in each of the resists and scanning electron microscope (SEM) images of the moulds are presented and analysed. Then, electroformed nickel components from the micromoulds are presented. Finally, applicability of the photoresists to electroforming microcomponents is discussed. Each of the resists demonstrates advantages and disadvantages to suit different applications.

KW - micromoulds

KW - microelectroforming

KW - SU8

KW - KMPR

KW - BPR100

U2 - 10.1243/09544062jmes786

DO - 10.1243/09544062jmes786

M3 - Article

SN - 2041-2983

VL - 222

SP - 37

EP - 42

JO - Institution of Mechanical Engineers. Proceedings. Part C: Journal of Mechanical Engineering Science

JF - Institution of Mechanical Engineers. Proceedings. Part C: Journal of Mechanical Engineering Science

IS - 1

ER -

Thick photoresists for electroforming metallic microcomponents

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