Progress on microwave devices fabricated using stereolithography 3-D printing technique

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Authors

Colleges, School and Institutes

External organisations

  • School of Physical Electronics, University of Electronic Science and Technology of China

Abstract

In this paper, recent advances in metallic coated photosensitive-resin-based microwave passive devices fabricated using stereolithography 3-D printing technique are reviewed. Considerations in the design and fabrication technology of these devices are discussed. This new family of 3-D printed microwave devices have advantages of light weight and flexibility in structural design over the conventional ones made from metals.

Details

Original languageEnglish
Title of host publication2017 International Applied Computational Electromagnetics Society Symposium in China, ACES-China 2017
Publication statusE-pub ahead of print - 28 Sep 2017
Event2017 International Applied Computational Electromagnetics Society Symposium in China, ACES-China 2017 - Suzhou, China
Duration: 1 Aug 20174 Aug 2017

Conference

Conference2017 International Applied Computational Electromagnetics Society Symposium in China, ACES-China 2017
CountryChina
CitySuzhou
Period1/08/174/08/17

Keywords

  • 3-D printed, bandpass filter, ceramic-filled resin, electroless plating, electroplating, stereolithography