Progress on microwave devices fabricated using stereolithography 3-D printing technique
Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
Authors
Colleges, School and Institutes
External organisations
- School of Physical Electronics, University of Electronic Science and Technology of China
Abstract
In this paper, recent advances in metallic coated photosensitive-resin-based microwave passive devices fabricated using stereolithography 3-D printing technique are reviewed. Considerations in the design and fabrication technology of these devices are discussed. This new family of 3-D printed microwave devices have advantages of light weight and flexibility in structural design over the conventional ones made from metals.
Details
Original language | English |
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Title of host publication | 2017 International Applied Computational Electromagnetics Society Symposium in China, ACES-China 2017 |
Publication status | E-pub ahead of print - 28 Sep 2017 |
Event | 2017 International Applied Computational Electromagnetics Society Symposium in China, ACES-China 2017 - Suzhou, China Duration: 1 Aug 2017 → 4 Aug 2017 |
Conference
Conference | 2017 International Applied Computational Electromagnetics Society Symposium in China, ACES-China 2017 |
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Country | China |
City | Suzhou |
Period | 1/08/17 → 4/08/17 |
Keywords
- 3-D printed, bandpass filter, ceramic-filled resin, electroless plating, electroplating, stereolithography