Printed circuit board as a MEMS platform for focused ion beam technology

Research output: Contribution to journalArticle

Colleges, School and Institutes


By combining low-cost printed circuit board technology and focused ion beam techniques, a simple method has been developed to produce thermal microsensors in a robust package with straightforward electrical connectivity. Two devices have been developed to demonstrate the principle. The first was fabricated using a single step process comprised of FIB deposited platinum. The second device utilised a multistep process using FIB milled thermally evaporated Au on a PCB platform with through-plated vias. The performance of these devices was tested by measuring their thermo-electrical characteristics. (C) 2010 Elsevier B.V. All rights reserved.


Original languageEnglish
Pages (from-to)121-126
Number of pages6
JournalMicroelectronic Engineering
Issue number1
Publication statusPublished - 1 Jan 2011


  • Thermal sensor, Focused ion beam, Printed circuit board