Printed circuit board as a MEMS platform for focused ion beam technology
Research output: Contribution to journal › Article
By combining low-cost printed circuit board technology and focused ion beam techniques, a simple method has been developed to produce thermal microsensors in a robust package with straightforward electrical connectivity. Two devices have been developed to demonstrate the principle. The first was fabricated using a single step process comprised of FIB deposited platinum. The second device utilised a multistep process using FIB milled thermally evaporated Au on a PCB platform with through-plated vias. The performance of these devices was tested by measuring their thermo-electrical characteristics. (C) 2010 Elsevier B.V. All rights reserved.
|Number of pages||6|
|Publication status||Published - 1 Jan 2011|
- Thermal sensor, Focused ion beam, Printed circuit board