Performance study of phase change materials coupled with three-dimensional oscillating heat pipes with different structures for electronic cooling

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Performance study of phase change materials coupled with three-dimensional oscillating heat pipes with different structures for electronic cooling. / Ling, Yun-Zhi; Zhang, Xiao-Song; Wang, Feng; She, Xiao-hui.

In: Renewable Energy, Vol. 154, 07.2020, p. 636-649.

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@article{0192154f0c5244e897672e010d05eb47,
title = "Performance study of phase change materials coupled with three-dimensional oscillating heat pipes with different structures for electronic cooling",
abstract = "Electronic cooling has been a rising issue mainly due to the rapid development of high-throughput computing in data centres as well as battery energy storage, which release huge amount of heat through compact surfaces. The electronic cooling process is not only energy-intensive but also difficult to control. This paper proposes an effective cooling method for electronic devices by integrating phase change materials (PCMs) with three-dimensional oscillating heat pipes (3D-OHPs), where PCMs are used to store heat dissipated by the electronic device and 3D-OHPs to fast transport the stored heat from PCMs to the environment. A novel leaf-shaped structure is designed for the 3D-OHPs. Experimental study is carried out on the leaf-shaped 3D-OHPs with various working parameters including cooling air velocity, wind direction and heat input. Further, the leaf-shaped 3D-OHPs are embedded into PCMs to cool down the electronic devices. Temperature variations and thermal resistance are evaluated and compared with the conventional air cooling method. The experimental results indicate that the surface temperature of electronic devices can be well controlled below 100 °C, which is ∼35 °C lower than that with conventional air cooling. The thermal resistance is decreased up to 36.3%. The 3D-OHPs with a filling ratio of 34–44% achieve the best thermal performance. What{\textquoteright}s more, the leaf-shaped structure of the 3D-OHPs contributes to a ∼2 °C lower temperature on the electronic device{\textquoteright}s surface than the typical used 3D-OHPs. This research will promote the development of effective cooling for electronic devices.",
keywords = "thermal energy storage, heat pipe, phase change material, electronic cooling, thermal management",
author = "Yun-Zhi Ling and Xiao-Song Zhang and Feng Wang and Xiao-hui She",
year = "2020",
month = jul,
doi = "10.1016/j.renene.2020.03.008",
language = "English",
volume = "154",
pages = "636--649",
journal = "Renewable Energy",
issn = "0960-1481",
publisher = "Elsevier Korea",

}

RIS

TY - JOUR

T1 - Performance study of phase change materials coupled with three-dimensional oscillating heat pipes with different structures for electronic cooling

AU - Ling, Yun-Zhi

AU - Zhang, Xiao-Song

AU - Wang, Feng

AU - She, Xiao-hui

PY - 2020/7

Y1 - 2020/7

N2 - Electronic cooling has been a rising issue mainly due to the rapid development of high-throughput computing in data centres as well as battery energy storage, which release huge amount of heat through compact surfaces. The electronic cooling process is not only energy-intensive but also difficult to control. This paper proposes an effective cooling method for electronic devices by integrating phase change materials (PCMs) with three-dimensional oscillating heat pipes (3D-OHPs), where PCMs are used to store heat dissipated by the electronic device and 3D-OHPs to fast transport the stored heat from PCMs to the environment. A novel leaf-shaped structure is designed for the 3D-OHPs. Experimental study is carried out on the leaf-shaped 3D-OHPs with various working parameters including cooling air velocity, wind direction and heat input. Further, the leaf-shaped 3D-OHPs are embedded into PCMs to cool down the electronic devices. Temperature variations and thermal resistance are evaluated and compared with the conventional air cooling method. The experimental results indicate that the surface temperature of electronic devices can be well controlled below 100 °C, which is ∼35 °C lower than that with conventional air cooling. The thermal resistance is decreased up to 36.3%. The 3D-OHPs with a filling ratio of 34–44% achieve the best thermal performance. What’s more, the leaf-shaped structure of the 3D-OHPs contributes to a ∼2 °C lower temperature on the electronic device’s surface than the typical used 3D-OHPs. This research will promote the development of effective cooling for electronic devices.

AB - Electronic cooling has been a rising issue mainly due to the rapid development of high-throughput computing in data centres as well as battery energy storage, which release huge amount of heat through compact surfaces. The electronic cooling process is not only energy-intensive but also difficult to control. This paper proposes an effective cooling method for electronic devices by integrating phase change materials (PCMs) with three-dimensional oscillating heat pipes (3D-OHPs), where PCMs are used to store heat dissipated by the electronic device and 3D-OHPs to fast transport the stored heat from PCMs to the environment. A novel leaf-shaped structure is designed for the 3D-OHPs. Experimental study is carried out on the leaf-shaped 3D-OHPs with various working parameters including cooling air velocity, wind direction and heat input. Further, the leaf-shaped 3D-OHPs are embedded into PCMs to cool down the electronic devices. Temperature variations and thermal resistance are evaluated and compared with the conventional air cooling method. The experimental results indicate that the surface temperature of electronic devices can be well controlled below 100 °C, which is ∼35 °C lower than that with conventional air cooling. The thermal resistance is decreased up to 36.3%. The 3D-OHPs with a filling ratio of 34–44% achieve the best thermal performance. What’s more, the leaf-shaped structure of the 3D-OHPs contributes to a ∼2 °C lower temperature on the electronic device’s surface than the typical used 3D-OHPs. This research will promote the development of effective cooling for electronic devices.

KW - thermal energy storage

KW - heat pipe

KW - phase change material

KW - electronic cooling

KW - thermal management

U2 - 10.1016/j.renene.2020.03.008

DO - 10.1016/j.renene.2020.03.008

M3 - Article

VL - 154

SP - 636

EP - 649

JO - Renewable Energy

JF - Renewable Energy

SN - 0960-1481

ER -