Overview of Materials and Processes for Lithgography

Research output: Chapter in Book/Report/Conference proceedingChapter

Authors

Colleges, School and Institutes

External organisations

  • Milliken & Company

Abstract

Computers and other electronic devices are an integral and ubiquitous part of the modern world. One of the key drivers for the development, power, cost, and availability of these devices is the procedure known as lithography where the circuit pattern is written on the chip at the micrometer and nanometer length scale. This chapter provides an overview of the materials and processes that are involved in lithography. The various different lithographic exposure tools are reviewed and their capabilities are discussed along with comparisons of the advantages and disadvantages of each. The key material in lithography is the resist or photoresist. Resist figures of merit are defined and their importance is elaborated. The array of different resist families and types used historically, currently, and those under development are reviewed along with their benefits and weaknesses. Finally, some of the specific challenges and difficulties facing future resist materials and processes are discussed.

Details

Original languageEnglish
Title of host publicationMaterials and Processes for Next Generation Lithography
Publication statusPublished - 18 Nov 2016

Publication series

NameFrontiers of Nanoscience
PublisherElsevier
Volume11
ISSN (Print)1876-2778

Keywords

  • Acid diffusion, Resist metrics, Photoresist, Photoacid generator , Pattern collapse , Lithography, Exposure tools , EUV, Chemically amplified resist