@inbook{3a601453d78c4bc6982b8c4448dce9d4,
title = "Overview of Materials and Processes for Lithgography",
abstract = "Computers and other electronic devices are an integral and ubiquitous part of the modern world. One of the key drivers for the development, power, cost, and availability of these devices is the procedure known as lithography where the circuit pattern is written on the chip at the micrometer and nanometer length scale. This chapter provides an overview of the materials and processes that are involved in lithography. The various different lithographic exposure tools are reviewed and their capabilities are discussed along with comparisons of the advantages and disadvantages of each. The key material in lithography is the resist or photoresist. Resist figures of merit are defined and their importance is elaborated. The array of different resist families and types used historically, currently, and those under development are reviewed along with their benefits and weaknesses. Finally, some of the specific challenges and difficulties facing future resist materials and processes are discussed.",
keywords = "Acid diffusion, Resist metrics, Photoresist, Photoacid generator , Pattern collapse , Lithography, Exposure tools , EUV, Chemically amplified resist",
author = "Richard Lawson and Alexander Robinson",
year = "2016",
month = nov,
day = "18",
doi = "10.1016/B978-0-08-100354-1.00001-6",
language = "English",
isbn = "9780081003541",
volume = "11",
series = "Frontiers of Nanoscience",
publisher = "Elsevier",
pages = "1--90",
booktitle = "Materials and Processes for Next Generation Lithography",
edition = "1",
}