Observations of intermetallic compound formation of hot dip aluminized steel

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Standard

Observations of intermetallic compound formation of hot dip aluminized steel. / Kim, Kee Hyun; Benny, Van Daele; Gustaaf, Van Tendeloo; Yoon, Jong Kyu.

Aluminium Alloys 2006: Research Through Innovation and Technology - Proceedings of the 10th International Conference on Aluminium Alloys. PART 2. ed. Trans Tech Publications Ltd, 2006. p. 1871-1876 (Materials Science Forum; Vol. 519-521, No. PART 2).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Harvard

Kim, KH, Benny, VD, Gustaaf, VT & Yoon, JK 2006, Observations of intermetallic compound formation of hot dip aluminized steel. in Aluminium Alloys 2006: Research Through Innovation and Technology - Proceedings of the 10th International Conference on Aluminium Alloys. PART 2 edn, Materials Science Forum, no. PART 2, vol. 519-521, Trans Tech Publications Ltd, pp. 1871-1876, 10th International Conference on Aluminium Alloys, (ICAA-10), Vancouver, Canada, 9/07/06. https://doi.org/10.4028/www.scientific.net/msf.519-521.1871

APA

Kim, K. H., Benny, V. D., Gustaaf, V. T., & Yoon, J. K. (2006). Observations of intermetallic compound formation of hot dip aluminized steel. In Aluminium Alloys 2006: Research Through Innovation and Technology - Proceedings of the 10th International Conference on Aluminium Alloys (PART 2 ed., pp. 1871-1876). (Materials Science Forum; Vol. 519-521, No. PART 2). Trans Tech Publications Ltd. https://doi.org/10.4028/www.scientific.net/msf.519-521.1871

Vancouver

Kim KH, Benny VD, Gustaaf VT, Yoon JK. Observations of intermetallic compound formation of hot dip aluminized steel. In Aluminium Alloys 2006: Research Through Innovation and Technology - Proceedings of the 10th International Conference on Aluminium Alloys. PART 2 ed. Trans Tech Publications Ltd. 2006. p. 1871-1876. (Materials Science Forum; PART 2). https://doi.org/10.4028/www.scientific.net/msf.519-521.1871

Author

Kim, Kee Hyun ; Benny, Van Daele ; Gustaaf, Van Tendeloo ; Yoon, Jong Kyu. / Observations of intermetallic compound formation of hot dip aluminized steel. Aluminium Alloys 2006: Research Through Innovation and Technology - Proceedings of the 10th International Conference on Aluminium Alloys. PART 2. ed. Trans Tech Publications Ltd, 2006. pp. 1871-1876 (Materials Science Forum; PART 2).

Bibtex

@inproceedings{a9e91ea1f7ad4cd5b7c9a35844cb70e2,
title = "Observations of intermetallic compound formation of hot dip aluminized steel",
abstract = "A hot dip aluminizing process to simulate the continuous galvanizing line (CGL) was carried out in three successive steps by a hot dip simulator: the pre-treatment for removing scales on the 200 × 250 mm2 and 1mm in thickness cold rolled steel sheet, the dipping in 660°C Al-Si melt for 3s and the cooling. In a pre-treatment, the steel specimen was partly coated by Au to confirm the mechanism of intermetallic compound (IMC) formation. Scanning electron microscopy (SEM), energy dispersive X-ray spectroscopy (EDX), and transmission electron microscopy (TEM) analyses were followed to observe the cross-section and the distribution of the elements. The specimen was analyzed in the boundary of the dipped-undipped part to see the formation mechanism of the aluminized steel. An intermetallic compound (IMC) is rapidly developed and grown in the steel-liquid interface. It has been usually reported that the IMC was formed by the dissolution of iron in the steel substrate toward the melt and the diffusion of aluminum in an opposite direction. The specimen is covered with aluminum-10 wt.% silicon, forms the IMC in the part that was not Au coated. However, IMC is not formed in the Au-coated part. The interface of the dipped-undipped is also analyzed by EDX. At the interface of the steel-IMC, it is clearly shown that the IMC is only formed in the dipped part and exists in the steel substrate as well, and contributes by iron, aluminum and silicon. The result clearly shows that only aluminum diffuses into the steel substrate without the dissolution of iron and forms the IMC between the steel substrate and the melt. Au coating and the short dipping time prevent the iron from dissolving into the aluminum melt. By TEM combined with focused ion beam (FIB) sample preparation, the IMC is confirmed as Fe2SiAlg, a hexagonal structure with space group P63/mmc.",
keywords = "Diffusion, Dissolution, Hot dip aluminizing process, Interface, Intermetallic compound",
author = "Kim, {Kee Hyun} and Benny, {Van Daele} and Gustaaf, {Van Tendeloo} and Yoon, {Jong Kyu}",
year = "2006",
doi = "10.4028/www.scientific.net/msf.519-521.1871",
language = "English",
isbn = "9780878494088",
series = "Materials Science Forum",
publisher = "Trans Tech Publications Ltd",
number = "PART 2",
pages = "1871--1876",
booktitle = "Aluminium Alloys 2006",
edition = "PART 2",
note = "10th International Conference on Aluminium Alloys, (ICAA-10) ; Conference date: 09-07-2006 Through 13-07-2006",

}

RIS

TY - GEN

T1 - Observations of intermetallic compound formation of hot dip aluminized steel

AU - Kim, Kee Hyun

AU - Benny, Van Daele

AU - Gustaaf, Van Tendeloo

AU - Yoon, Jong Kyu

PY - 2006

Y1 - 2006

N2 - A hot dip aluminizing process to simulate the continuous galvanizing line (CGL) was carried out in three successive steps by a hot dip simulator: the pre-treatment for removing scales on the 200 × 250 mm2 and 1mm in thickness cold rolled steel sheet, the dipping in 660°C Al-Si melt for 3s and the cooling. In a pre-treatment, the steel specimen was partly coated by Au to confirm the mechanism of intermetallic compound (IMC) formation. Scanning electron microscopy (SEM), energy dispersive X-ray spectroscopy (EDX), and transmission electron microscopy (TEM) analyses were followed to observe the cross-section and the distribution of the elements. The specimen was analyzed in the boundary of the dipped-undipped part to see the formation mechanism of the aluminized steel. An intermetallic compound (IMC) is rapidly developed and grown in the steel-liquid interface. It has been usually reported that the IMC was formed by the dissolution of iron in the steel substrate toward the melt and the diffusion of aluminum in an opposite direction. The specimen is covered with aluminum-10 wt.% silicon, forms the IMC in the part that was not Au coated. However, IMC is not formed in the Au-coated part. The interface of the dipped-undipped is also analyzed by EDX. At the interface of the steel-IMC, it is clearly shown that the IMC is only formed in the dipped part and exists in the steel substrate as well, and contributes by iron, aluminum and silicon. The result clearly shows that only aluminum diffuses into the steel substrate without the dissolution of iron and forms the IMC between the steel substrate and the melt. Au coating and the short dipping time prevent the iron from dissolving into the aluminum melt. By TEM combined with focused ion beam (FIB) sample preparation, the IMC is confirmed as Fe2SiAlg, a hexagonal structure with space group P63/mmc.

AB - A hot dip aluminizing process to simulate the continuous galvanizing line (CGL) was carried out in three successive steps by a hot dip simulator: the pre-treatment for removing scales on the 200 × 250 mm2 and 1mm in thickness cold rolled steel sheet, the dipping in 660°C Al-Si melt for 3s and the cooling. In a pre-treatment, the steel specimen was partly coated by Au to confirm the mechanism of intermetallic compound (IMC) formation. Scanning electron microscopy (SEM), energy dispersive X-ray spectroscopy (EDX), and transmission electron microscopy (TEM) analyses were followed to observe the cross-section and the distribution of the elements. The specimen was analyzed in the boundary of the dipped-undipped part to see the formation mechanism of the aluminized steel. An intermetallic compound (IMC) is rapidly developed and grown in the steel-liquid interface. It has been usually reported that the IMC was formed by the dissolution of iron in the steel substrate toward the melt and the diffusion of aluminum in an opposite direction. The specimen is covered with aluminum-10 wt.% silicon, forms the IMC in the part that was not Au coated. However, IMC is not formed in the Au-coated part. The interface of the dipped-undipped is also analyzed by EDX. At the interface of the steel-IMC, it is clearly shown that the IMC is only formed in the dipped part and exists in the steel substrate as well, and contributes by iron, aluminum and silicon. The result clearly shows that only aluminum diffuses into the steel substrate without the dissolution of iron and forms the IMC between the steel substrate and the melt. Au coating and the short dipping time prevent the iron from dissolving into the aluminum melt. By TEM combined with focused ion beam (FIB) sample preparation, the IMC is confirmed as Fe2SiAlg, a hexagonal structure with space group P63/mmc.

KW - Diffusion

KW - Dissolution

KW - Hot dip aluminizing process

KW - Interface

KW - Intermetallic compound

UR - http://www.scopus.com/inward/record.url?scp=37849053729&partnerID=8YFLogxK

U2 - 10.4028/www.scientific.net/msf.519-521.1871

DO - 10.4028/www.scientific.net/msf.519-521.1871

M3 - Conference contribution

AN - SCOPUS:37849053729

SN - 9780878494088

T3 - Materials Science Forum

SP - 1871

EP - 1876

BT - Aluminium Alloys 2006

PB - Trans Tech Publications Ltd

T2 - 10th International Conference on Aluminium Alloys, (ICAA-10)

Y2 - 9 July 2006 through 13 July 2006

ER -