Abstract
During flexible optoelectronic device packaging, acid containing layers initiate the functional failure of the underlying indium tin oxide film. We experimentally investigate the stress-assisted corrosion cracking of thin conductive optoelectronic components. It is essential to understand the stress corrosion mechanisms in order to design highly durable flexible electronic structures.
Original language | English |
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Pages (from-to) | 1461-1464 |
Number of pages | 4 |
Journal | Digest of Technical Papers - SID International Symposium |
Volume | 39 |
Issue number | 3 |
Publication status | Published - 30 Oct 2008 |
Event | 2008 SID International Symposium - Los Angeles, CA, United States Duration: 20 May 2008 → 21 May 2008 |
ASJC Scopus subject areas
- Engineering(all)