Increasing the reliability of wind turbines using condition monitoring of semiconductor devices: a review

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

The majority of electrical failures of wind turbines occur in the semiconductor devices of both grid and generator converters. This is due to the temperature swings caused by the variability of wind speed, which causes the progressive degradation of semiconductor devices. In order to increase reliability and decrease the operating costs, several condition monitoring methods have been proposed in the technical literature for the semiconductor devices used in WT converters. This paper comparatively reviews these methods and tries to give directions on the future steps that should be addressed by the research on this area.

Details

Original languageEnglish
Title of host publication5th IET International Conference on Renewable Power Generation (RPG) 2016
Publication statusPublished - 30 Jan 2017
Event5th IET International Conference on Renewable Power Generation, RPG 2016 - London, United Kingdom
Duration: 21 Sep 201623 Sep 2016

Publication series

NameIET International Conference on Renewable Power Generation (RPG) 2016

Conference

Conference5th IET International Conference on Renewable Power Generation, RPG 2016
CountryUnited Kingdom
CityLondon
Period21/09/1623/09/16

Keywords

  • Condition monitoring, Fault detection, Wind turbines

ASJC Scopus subject areas