Increasing the reliability of wind turbines using condition monitoring of semiconductor devices: a review
Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
Authors
Colleges, School and Institutes
Abstract
The majority of electrical failures of wind turbines occur in the semiconductor devices of both grid and generator converters. This is due to the temperature swings caused by the variability of wind speed, which causes the progressive degradation of semiconductor devices. In order to increase reliability and decrease the operating costs, several condition monitoring methods have been proposed in the technical literature for the semiconductor devices used in WT converters. This paper comparatively reviews these methods and tries to give directions on the future steps that should be addressed by the research on this area.
Details
Original language | English |
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Title of host publication | 5th IET International Conference on Renewable Power Generation (RPG) 2016 |
Publication status | Published - 30 Jan 2017 |
Event | 5th IET International Conference on Renewable Power Generation, RPG 2016 - London, United Kingdom Duration: 21 Sep 2016 → 23 Sep 2016 |
Publication series
Name | IET International Conference on Renewable Power Generation (RPG) 2016 |
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Conference
Conference | 5th IET International Conference on Renewable Power Generation, RPG 2016 |
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Country | United Kingdom |
City | London |
Period | 21/09/16 → 23/09/16 |
Keywords
- Condition monitoring, Fault detection, Wind turbines