Increasing the accuracy of 3D EEG implantations
Research output: Contribution to journal › Article
Colleges, School and Institutes
- University College London
The accuracy of stereoelectroencephalography (SEEG) electrode implantation is an important factor in maximizing its safety. The authors established a quality assurance (QA) process to aid advances in implantation accuracy.
The accuracy of three consecutive modifications of a frameless implantation technique was quantified in three cohorts comprising 22, 8, and 23 consecutive patients. The modifications of the technique aimed to increase accuracy of the bolt placement.
The lateral shift of the axis of the implanted bolt at the level of the planned entry point was reduced from a mean of 3.0 ± 1.6 mm to 1.4 ± 0.8 mm. The lateral shift of the axis of the implanted bolt at the level of the planned target point was reduced from a mean of 3.8 ± 2.5 mm to 1.6 ± 0.9 mm.
This QA framework helped to isolate and quantify the factors introducing inaccuracy in SEEG implantation, and to monitor ongoing accuracy and the effect of technique modifications.
|Number of pages||8|
|Journal||Journal of Neurosurgery|
|Early online date||17 May 2019|
|Publication status||E-pub ahead of print - 17 May 2019|
- implantation, accuracy, quality assurance, SEEG, epilepsy