Increasing the accuracy of 3D EEG implantations

Research output: Contribution to journalArticle

Authors

  • Roman Rodionov
  • Aidan O'Keeffe
  • Mark Nowell
  • Michele Rizzi
  • Vejay N Vakharia
  • Sofia H Eriksson
  • Anna Miserocchi
  • Andrew W McEvoy
  • Sebastien Ourselin
  • John S Duncan

Colleges, School and Institutes

External organisations

  • University College London

Abstract

OBJECTIVE

The accuracy of stereoelectroencephalography (SEEG) electrode implantation is an important factor in maximizing its safety. The authors established a quality assurance (QA) process to aid advances in implantation accuracy.

METHODS

The accuracy of three consecutive modifications of a frameless implantation technique was quantified in three cohorts comprising 22, 8, and 23 consecutive patients. The modifications of the technique aimed to increase accuracy of the bolt placement.

RESULTS

The lateral shift of the axis of the implanted bolt at the level of the planned entry point was reduced from a mean of 3.0 ± 1.6 mm to 1.4 ± 0.8 mm. The lateral shift of the axis of the implanted bolt at the level of the planned target point was reduced from a mean of 3.8 ± 2.5 mm to 1.6 ± 0.9 mm.

CONCLUSIONS

This QA framework helped to isolate and quantify the factors introducing inaccuracy in SEEG implantation, and to monitor ongoing accuracy and the effect of technique modifications.

Details

Original languageEnglish
Pages (from-to)1-8
Number of pages8
JournalJournal of Neurosurgery
Early online date17 May 2019
Publication statusE-pub ahead of print - 17 May 2019

Keywords

  • implantation, accuracy, quality assurance, SEEG, epilepsy