GaAs Schottky Components for 300 GHz Communication Systems using a Resonator Impedance Matching Approach

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Standard

GaAs Schottky Components for 300 GHz Communication Systems using a Resonator Impedance Matching Approach. / Lancaster, Michael J.; Guo, Cheng; Powell, Jeff; Wang, Hui; Parow-Souchon, Kai; Huggard, Peter G.; Wang, Yi.

IRMMW-THz 2019 - 44th International Conference on Infrared, Millimeter, and Terahertz Waves. IEEE Computer Society, 2019. 8874014 (International Conference on Infrared, Millimeter, and Terahertz Waves, IRMMW-THz; Vol. 2019-September).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Harvard

Lancaster, MJ, Guo, C, Powell, J, Wang, H, Parow-Souchon, K, Huggard, PG & Wang, Y 2019, GaAs Schottky Components for 300 GHz Communication Systems using a Resonator Impedance Matching Approach. in IRMMW-THz 2019 - 44th International Conference on Infrared, Millimeter, and Terahertz Waves., 8874014, International Conference on Infrared, Millimeter, and Terahertz Waves, IRMMW-THz, vol. 2019-September, IEEE Computer Society, 44th International Conference on Infrared, Millimeter, and Terahertz Waves, IRMMW-THz 2019, Paris, France, 1/09/19. https://doi.org/10.1109/IRMMW-THz.2019.8874014

APA

Lancaster, M. J., Guo, C., Powell, J., Wang, H., Parow-Souchon, K., Huggard, P. G., & Wang, Y. (2019). GaAs Schottky Components for 300 GHz Communication Systems using a Resonator Impedance Matching Approach. In IRMMW-THz 2019 - 44th International Conference on Infrared, Millimeter, and Terahertz Waves [8874014] (International Conference on Infrared, Millimeter, and Terahertz Waves, IRMMW-THz; Vol. 2019-September). IEEE Computer Society. https://doi.org/10.1109/IRMMW-THz.2019.8874014

Vancouver

Lancaster MJ, Guo C, Powell J, Wang H, Parow-Souchon K, Huggard PG et al. GaAs Schottky Components for 300 GHz Communication Systems using a Resonator Impedance Matching Approach. In IRMMW-THz 2019 - 44th International Conference on Infrared, Millimeter, and Terahertz Waves. IEEE Computer Society. 2019. 8874014. (International Conference on Infrared, Millimeter, and Terahertz Waves, IRMMW-THz). https://doi.org/10.1109/IRMMW-THz.2019.8874014

Author

Lancaster, Michael J. ; Guo, Cheng ; Powell, Jeff ; Wang, Hui ; Parow-Souchon, Kai ; Huggard, Peter G. ; Wang, Yi. / GaAs Schottky Components for 300 GHz Communication Systems using a Resonator Impedance Matching Approach. IRMMW-THz 2019 - 44th International Conference on Infrared, Millimeter, and Terahertz Waves. IEEE Computer Society, 2019. (International Conference on Infrared, Millimeter, and Terahertz Waves, IRMMW-THz).

Bibtex

@inproceedings{8da406b2ed4a4bb79f350155bd72d01a,
title = "GaAs Schottky Components for 300 GHz Communication Systems using a Resonator Impedance Matching Approach",
abstract = "A interconnection method has been developed to integrate GaAs Schottky diode components with hollow metal waveguides. Instead of using wired or probe impedance matching, an integrated resonator matching circuit has been adopted and a co-design method of active components with waveguide cavity filters developed. The approach transfers most of the matching circuitry from the lossy microstrip to low loss waveguide cavities. It minimises the footprint of the transition and improves the efficiency of the interconnection. This paper reviews the design and test of several building block components for a 300 GHz communications system. A 290-310 GHz single sideband mixer incorporates an integrated waveguide filter to achieve the required image rejection and impedance matching. A 135-150 GHz frequency tripler shows good impedance matching performance with an additional built-in filtering function.",
author = "Lancaster, {Michael J.} and Cheng Guo and Jeff Powell and Hui Wang and Kai Parow-Souchon and Huggard, {Peter G.} and Yi Wang",
note = "Publisher Copyright: {\textcopyright} 2019 IEEE. Copyright: Copyright 2019 Elsevier B.V., All rights reserved.; 44th International Conference on Infrared, Millimeter, and Terahertz Waves, IRMMW-THz 2019 ; Conference date: 01-09-2019 Through 06-09-2019",
year = "2019",
month = sep,
doi = "10.1109/IRMMW-THz.2019.8874014",
language = "English",
series = "International Conference on Infrared, Millimeter, and Terahertz Waves, IRMMW-THz",
publisher = "IEEE Computer Society",
booktitle = "IRMMW-THz 2019 - 44th International Conference on Infrared, Millimeter, and Terahertz Waves",
address = "United States",

}

RIS

TY - GEN

T1 - GaAs Schottky Components for 300 GHz Communication Systems using a Resonator Impedance Matching Approach

AU - Lancaster, Michael J.

AU - Guo, Cheng

AU - Powell, Jeff

AU - Wang, Hui

AU - Parow-Souchon, Kai

AU - Huggard, Peter G.

AU - Wang, Yi

N1 - Publisher Copyright: © 2019 IEEE. Copyright: Copyright 2019 Elsevier B.V., All rights reserved.

PY - 2019/9

Y1 - 2019/9

N2 - A interconnection method has been developed to integrate GaAs Schottky diode components with hollow metal waveguides. Instead of using wired or probe impedance matching, an integrated resonator matching circuit has been adopted and a co-design method of active components with waveguide cavity filters developed. The approach transfers most of the matching circuitry from the lossy microstrip to low loss waveguide cavities. It minimises the footprint of the transition and improves the efficiency of the interconnection. This paper reviews the design and test of several building block components for a 300 GHz communications system. A 290-310 GHz single sideband mixer incorporates an integrated waveguide filter to achieve the required image rejection and impedance matching. A 135-150 GHz frequency tripler shows good impedance matching performance with an additional built-in filtering function.

AB - A interconnection method has been developed to integrate GaAs Schottky diode components with hollow metal waveguides. Instead of using wired or probe impedance matching, an integrated resonator matching circuit has been adopted and a co-design method of active components with waveguide cavity filters developed. The approach transfers most of the matching circuitry from the lossy microstrip to low loss waveguide cavities. It minimises the footprint of the transition and improves the efficiency of the interconnection. This paper reviews the design and test of several building block components for a 300 GHz communications system. A 290-310 GHz single sideband mixer incorporates an integrated waveguide filter to achieve the required image rejection and impedance matching. A 135-150 GHz frequency tripler shows good impedance matching performance with an additional built-in filtering function.

UR - http://www.scopus.com/inward/record.url?scp=85074692774&partnerID=8YFLogxK

U2 - 10.1109/IRMMW-THz.2019.8874014

DO - 10.1109/IRMMW-THz.2019.8874014

M3 - Conference contribution

AN - SCOPUS:85074692774

T3 - International Conference on Infrared, Millimeter, and Terahertz Waves, IRMMW-THz

BT - IRMMW-THz 2019 - 44th International Conference on Infrared, Millimeter, and Terahertz Waves

PB - IEEE Computer Society

T2 - 44th International Conference on Infrared, Millimeter, and Terahertz Waves, IRMMW-THz 2019

Y2 - 1 September 2019 through 6 September 2019

ER -