Fabrication of Ni-Al2O3 composite microcomponent by electroforming

Xueyong Wei; Zhigang Zhu; Philip Prewett; Kyle Jiang

doi:10.1016/j.mee.2007.01.218

Fabrication of Ni-Al2O3 composite microcomponent by electroforming

Xueyong Wei, Zhigang Zhu, Philip Prewett, Kyle Jiang

Mechanical Engineering

Research output: Contribution to journal › Article

14 Citations (Scopus)

Abstract

Thick nickel-alumina (Ni-Al2O3) composite microcomponents containing dispersed alumina nanoparticles were fabricated by a combination of UV lithography and electroforming, using Shipley BPR100 resist to fabricate the micromoulds. Tests show that the microhardness of composite microcomponents is significantly improved over that of electroformed pure nickel components and that the structures maintain good fidelity. The method has potential for the fabrication of hard wearing microcomponents for micromachines and other applications. (c) 2007 Published by Elsevier B.V.

Original language	English
Pages (from-to)	1256-1259
Number of pages	4
Journal	Microelectronic Engineering
Volume	84
Issue number	5-8
DOIs	https://doi.org/10.1016/j.mee.2007.01.218
Publication status	Published - 1 Jan 2007

Keywords

electroforming
alumina nanoparticles
microcomponent

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10.1016/j.mee.2007.01.218

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@article{8ba2db99f94647edbe951e20e7399d1c,

title = "Fabrication of Ni-Al2O3 composite microcomponent by electroforming",

abstract = "Thick nickel-alumina (Ni-Al2O3) composite microcomponents containing dispersed alumina nanoparticles were fabricated by a combination of UV lithography and electroforming, using Shipley BPR100 resist to fabricate the micromoulds. Tests show that the microhardness of composite microcomponents is significantly improved over that of electroformed pure nickel components and that the structures maintain good fidelity. The method has potential for the fabrication of hard wearing microcomponents for micromachines and other applications. (c) 2007 Published by Elsevier B.V.",

keywords = "electroforming, alumina nanoparticles, microcomponent",

author = "Xueyong Wei and Zhigang Zhu and Philip Prewett and Kyle Jiang",

year = "2007",

month = jan,

day = "1",

doi = "10.1016/j.mee.2007.01.218",

language = "English",

volume = "84",

pages = "1256--1259",

journal = "Microelectronic Engineering",

issn = "1873-5568",

publisher = "Elsevier",

number = "5-8",

}

TY - JOUR

T1 - Fabrication of Ni-Al2O3 composite microcomponent by electroforming

AU - Wei, Xueyong

AU - Zhu, Zhigang

AU - Prewett, Philip

AU - Jiang, Kyle

PY - 2007/1/1

Y1 - 2007/1/1

N2 - Thick nickel-alumina (Ni-Al2O3) composite microcomponents containing dispersed alumina nanoparticles were fabricated by a combination of UV lithography and electroforming, using Shipley BPR100 resist to fabricate the micromoulds. Tests show that the microhardness of composite microcomponents is significantly improved over that of electroformed pure nickel components and that the structures maintain good fidelity. The method has potential for the fabrication of hard wearing microcomponents for micromachines and other applications. (c) 2007 Published by Elsevier B.V.

AB - Thick nickel-alumina (Ni-Al2O3) composite microcomponents containing dispersed alumina nanoparticles were fabricated by a combination of UV lithography and electroforming, using Shipley BPR100 resist to fabricate the micromoulds. Tests show that the microhardness of composite microcomponents is significantly improved over that of electroformed pure nickel components and that the structures maintain good fidelity. The method has potential for the fabrication of hard wearing microcomponents for micromachines and other applications. (c) 2007 Published by Elsevier B.V.

KW - electroforming

KW - alumina nanoparticles

KW - microcomponent

U2 - 10.1016/j.mee.2007.01.218

DO - 10.1016/j.mee.2007.01.218

M3 - Article

SN - 1873-5568

VL - 84

SP - 1256

EP - 1259

JO - Microelectronic Engineering

JF - Microelectronic Engineering

IS - 5-8

ER -

Fabrication of Ni-Al2O3 composite microcomponent by electroforming

Abstract

Keywords

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