Effect of hydrophobicity on enhancement of condensation heat transfer-numerical-investigation

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

In this work, a numerical study has been performed to investigate the effect of surface wettability on the condensation process at different subcooled temperatures using Computational Fluid Dynamics (CFD) simulation in Ansys Fluent. A new CFD model is developed to simulate vapour condensation on vertical smooth surface and surfaces with different hydrophobic coatings in terms of contact angle. Results revealed that the enhancement in condensation heat transfer in terms of heat flux for hydrophobic coatings with contact angle 140° and 150° are about 3 and 2 times, respectively, compared with the plain surface (90°), while less enhancement was achieved for others contact angles. In addition, the highest value of the liquid volume fraction is achieved when hydrophobic coating with contact angle 140° is used.

Original languageEnglish
Title of host publication2016 International Conference for Students on Applied Engineering (ICSAE)
EditorsZeyad Yousif Abdoon Al-Shibaany, Atheer F. Hameed
PublisherInstitute of Electrical and Electronics Engineers (IEEE)
Pages190-195
Number of pages6
ISBN (Electronic)978-1-4673-9053-8
ISBN (Print)978-1-4673-9028-6 (PoD)
DOIs
Publication statusPublished - 9 Jan 2017
Event1st International Conference for Students on Applied Engineering, ICSAE 2016 - Newcastle Upon Tyne, United Kingdom
Duration: 20 Oct 201621 Oct 2016

Publication series

NameInternational Conference for Students on Applied Engineering (ICSAE)

Conference

Conference1st International Conference for Students on Applied Engineering, ICSAE 2016
Country/TerritoryUnited Kingdom
CityNewcastle Upon Tyne
Period20/10/1621/10/16

Keywords

  • Ansys fluent
  • CFD
  • Condensation
  • Contact angle
  • Hydrophobic
  • Superhydrophobic
  • Surface wettability

ASJC Scopus subject areas

  • Energy Engineering and Power Technology
  • Automotive Engineering
  • Electrical and Electronic Engineering
  • Fluid Flow and Transfer Processes
  • Computer Networks and Communications
  • Mechanical Engineering

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