Analysis of the intermetallic compound formed in hot dip aluminized steel

Research output: Contribution to journalConference articlepeer-review

Authors

  • KeeHyun Park
  • Van Daele Benny
  • Van Tendeloo Gustaaf
  • Yong Sug Chung
  • Jong Kyu Yoon

Colleges, School and Institutes

External organisations

  • Material Science and Engineering
  • Seoul National University
  • University of Antwerp
  • Dongbu Steel Co. Ltd.

Abstract

A hot dip aluminising process was carried out with a 1mm steel sheet dipped into the Al-10at.% Si melt in an automatic hot-dip simulator. When steel and liquid aluminium are in contact with each other, a thin intermetallic compound (IMC) is formed between the steel and the aluminium. The analysis and identification of the formation mechanism of the IMC is needed to manufacture the application products. Energy dispersive X-ray spectroscopy (EDX) and electron probe microanalysis (EPMA) are normally used to identify the phases of IMC. In the Al-Fe-Si system, numerous compounds with only slight differences in composition are formed. Consequently, EDX and EPMA are insufficient to confirm exactly the thin IMC with multiphases. In this study, transmission electron microscopy (TEM) analysis combined with EDX was used. The TEM sample was prepared with focused ion beam (FIB) sampling. The FIB lift-out technology is used to slice a very thin specimen with minimum contamination for TEM analysis. It is clearly shown that the IMC consists of Al-27 at. % Fe-10 at. % Si and is identified as Al8Fe2Si with a hexagonal unit cell (space group P63/mmc). The cell parameters are a= 1.2404nm and c= 2.6234nm.

Details

Original languageEnglish
Pages (from-to)159-163
Number of pages5
JournalAdvanced Materials Research
Volume15-17
Publication statusPublished - 2007
Event5th International Conference on Processing and Manufacturing of Advanced Materials - THERMEC 2006 - Vancouver, BC, Canada
Duration: 4 Jul 20068 Jul 2006

Keywords

  • Al-coated steel, Focused ion beam, Hot dip aluminizing, Intermetallic compound, TEM

ASJC Scopus subject areas