A Full X-Band Fully 3-D Printed E-Plane Rectangular-Coax-to-Waveguide Transition
Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
Colleges, School and Institutes
- Shenzhen University, Shenzhen, China.
- Xi'an Jiaotong University
- South University of Science and Technology of China
- University of Electronic Science and Technology of China
This paper reports on a new class of broadband fully 3-D printed E-plane rectangular-coax-to-waveguide transition. This type of transition is adopted to interconnect two E-plane rectangular waveguides, and is based on a full air-filled waveguide structure without introducing other types of transmission lines (TLs). It exhibits little dielectric loss and dispersion, and furthermore a potentially enhanced power handling capability. The transition is constructed by a section of air-filled rectangular coaxial TL cascaded in series to a broadband coax-to-waveguide probe transition. A proof-of-concept X-band back-to-back transition is designed and prototyped monolithically by incorporating stereolithography-based 3-D printing and copper electroplating techniques. The RF-measured result demonstrates a broadband and low-loss characteristic of the transition - an insertion loss of averagely 0.5 dB and a return loss of mostly better than 15 dB at the entire X band.
|Title of host publication||2019 IEEE MTT-S International Microwave Symposium, IMS 2019|
|Publication status||Published - Jun 2019|
|Event||2019 IEEE MTT-S International Microwave Symposium, IMS 2019 - Boston, United States|
Duration: 2 Jun 2019 → 7 Jun 2019
|Name||IEEE MTT-S International Microwave Symposium Digest|
|Conference||2019 IEEE MTT-S International Microwave Symposium, IMS 2019|
|Period||2/06/19 → 7/06/19|