A Full X-Band Fully 3-D Printed E-Plane Rectangular-Coax-to-Waveguide Transition

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Authors

  • Jin Li
  • Cheng Guo
  • Yang Yu
  • Guan Long Huang
  • Tao Yuan
  • Jun Xu
  • Anxue Zhang

Colleges, School and Institutes

External organisations

  • Shenzhen University, Shenzhen, China.
  • Xi'an Jiaotong University
  • South University of Science and Technology of China
  • University of Electronic Science and Technology of China

Abstract

This paper reports on a new class of broadband fully 3-D printed E-plane rectangular-coax-to-waveguide transition. This type of transition is adopted to interconnect two E-plane rectangular waveguides, and is based on a full air-filled waveguide structure without introducing other types of transmission lines (TLs). It exhibits little dielectric loss and dispersion, and furthermore a potentially enhanced power handling capability. The transition is constructed by a section of air-filled rectangular coaxial TL cascaded in series to a broadband coax-to-waveguide probe transition. A proof-of-concept X-band back-to-back transition is designed and prototyped monolithically by incorporating stereolithography-based 3-D printing and copper electroplating techniques. The RF-measured result demonstrates a broadband and low-loss characteristic of the transition - an insertion loss of averagely 0.5 dB and a return loss of mostly better than 15 dB at the entire X band.

Bibliographic note

Funding Information: This work was supported in part by the National Natural Science Foundation of China under Grant No. 61801300, in part by the State Key Laboratory of Millimeter Waves under Grant No. K201932, and in part by the New Teacher Natural Science Research Project of Shenzhen University under Grant No. 2018078. Publisher Copyright: © 2019 IEEE. Copyright: Copyright 2020 Elsevier B.V., All rights reserved.

Details

Original languageEnglish
Title of host publication2019 IEEE MTT-S International Microwave Symposium, IMS 2019
Publication statusPublished - Jun 2019
Event2019 IEEE MTT-S International Microwave Symposium, IMS 2019 - Boston, United States
Duration: 2 Jun 20197 Jun 2019

Publication series

NameIEEE MTT-S International Microwave Symposium Digest
Volume2019-June
ISSN (Print)0149-645X

Conference

Conference2019 IEEE MTT-S International Microwave Symposium, IMS 2019
CountryUnited States
CityBoston
Period2/06/197/06/19

Keywords

  • 3-D printed, Air-filled transmission line, broadband, coax-to-waveguide transition, E-plane, rectangular coaxial line, stereolithography, waveguide