The Mechanical Behaviour of Silicon Diaphragms for Micromachined Capacitive Pressure Sensor

Research output: Contribution to conference (unpublished) › Paper

Original language	English
Pages	422-427
Number of pages	6
DOIs	https://doi.org/10.4028/www.scientific.net/AST.54.422
Publication status	Published - 1 Jan 2009
Event	3rd International Conference on Smart Materials, Structures and Systems, Jun 08-13, 2008. Acireale, Italy - Duration: 1 Jan 2009 → …

Conference	3rd International Conference on Smart Materials, Structures and Systems, Jun 08-13, 2008. Acireale, Italy
Period	1/01/09 → …

Keywords

@conference{fddb1d21d07b47b5808615e41624bf97,

title = "The Mechanical Behaviour of Silicon Diaphragms for Micromachined Capacitive Pressure Sensor",

keywords = "orthotropic properties, circular diaphragm, capacitive pressure sensors, silicon",

author = "Juan Ren and David Cheneler and Michael Ward and P Kinnell",

year = "2009",

month = jan,

day = "1",

doi = "10.4028/www.scientific.net/AST.54.422",

language = "English",

pages = "422--427",

note = "3rd International Conference on Smart Materials, Structures and Systems, Jun 08-13, 2008. Acireale, Italy ; Conference date: 01-01-2009",

}

TY - CONF

T1 - The Mechanical Behaviour of Silicon Diaphragms for Micromachined Capacitive Pressure Sensor

AU - Ren, Juan

AU - Cheneler, David

AU - Ward, Michael

AU - Kinnell, P

PY - 2009/1/1

Y1 - 2009/1/1

KW - orthotropic properties

KW - circular diaphragm

KW - capacitive pressure sensors

KW - silicon

U2 - 10.4028/www.scientific.net/AST.54.422

DO - 10.4028/www.scientific.net/AST.54.422

M3 - Paper

SP - 422

EP - 427

T2 - 3rd International Conference on Smart Materials, Structures and Systems, Jun 08-13, 2008. Acireale, Italy

Y2 - 1 January 2009

ER -