Terahertz Dielectric Measurements of Ceramic Substrate Materials Using Vector Network Analyzer and Time-Domain Spectrometer

Mingsheng Ma; Yi Wang; Miguel Navarro-Cia; Feng Liu; Zhifu Liu; Yongxiang Li; Mike Lancaster

Terahertz Dielectric Measurements of Ceramic Substrate Materials Using Vector Network Analyzer and Time-Domain Spectrometer

Mingsheng Ma, Yi Wang, Miguel Navarro-Cia, Feng Liu, Zhifu Liu, Yongxiang Li, Mike Lancaster

Research output: Contribution to conference (unpublished) › Poster › peer-review

Original language	English
Publication status	Published - Apr 2019
Event	15th Int. Conference and Exhibition on Ceramic Interconnect and Ceramic Microsystems Technologies - New World Shanghai Hotel , Shanghai, China Duration: 16 Apr 2019 → 19 Apr 2019

Conference

Conference	15th Int. Conference and Exhibition on Ceramic Interconnect and Ceramic Microsystems Technologies
Country/Territory	China
City	Shanghai
Period	16/04/19 → 19/04/19

Cite this

@conference{8b7d48a710464040a1909eda3b666f37,

title = "Terahertz Dielectric Measurements of Ceramic Substrate Materials Using Vector Network Analyzer and Time-Domain Spectrometer",

author = "Mingsheng Ma and Yi Wang and Miguel Navarro-Cia and Feng Liu and Zhifu Liu and Yongxiang Li and Mike Lancaster",

year = "2019",

month = apr,

language = "English",

note = "15th Int. Conference and Exhibition on Ceramic Interconnect and Ceramic Microsystems Technologies ; Conference date: 16-04-2019 Through 19-04-2019",

}

Terahertz Dielectric Measurements of Ceramic Substrate Materials Using Vector Network Analyzer and Time-Domain Spectrometer. / Ma, Mingsheng; Wang, Yi ; Navarro-Cia, Miguel et al.
2019. Poster session presented at 15th Int. Conference and Exhibition on Ceramic Interconnect and Ceramic Microsystems Technologies, Shanghai, China.

Research output: Contribution to conference (unpublished) › Poster › peer-review

TY - CONF

T1 - Terahertz Dielectric Measurements of Ceramic Substrate Materials Using Vector Network Analyzer and Time-Domain Spectrometer

AU - Ma, Mingsheng

AU - Wang, Yi

AU - Navarro-Cia, Miguel

AU - Liu, Feng

AU - Liu, Zhifu

AU - Li, Yongxiang

AU - Lancaster, Mike

PY - 2019/4

Y1 - 2019/4

M3 - Poster

T2 - 15th Int. Conference and Exhibition on Ceramic Interconnect and Ceramic Microsystems Technologies

Y2 - 16 April 2019 through 19 April 2019

ER -