Surface roughness characterization of silicon and SU-8 microcomponents

C. H. Lee*, K. Jiang, G. J. Davies

*Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceedingConference contribution

4 Citations (Scopus)

Abstract

Surface characterization of microcomponents provides key information to help understand and predict the performance of microdevices. In a microgear transmission, the surface roughness has a strong effect on the friction, running life and power consumption. In a static fluid microdevice, the liquid distribution is influenced by the surface tension and capillary force, which are primarily determined by the surface roughness. In a flowing microchannel case, surface roughness results in unsteady secondary flows. In this paper, a study is presented to characterize the surface roughness of silicon and SU-8 microcomponents. The silicon components studied are fabricated using STS ICP plasma etching system. The sidewall roughness of the component is measured using atomic force microscopy. Repeated measurements have been conducted at different sidewall depths of the microstructure. The AFM images of the measurements is given. The measurement results show that the sidewall is smoother at the lower level than that at the upper level in a Si microstrucutre, and the average roughness Ra obtained throughout the depth is 151.11 nm. The UltraThick SU-8 Process (UTSP) provides another way to fabricate microstructures as thick as 1 mm with a very vertical sidewall. The roughness contour of the sidewall shows that the surface topography is similar throughout the depth. The average roughness Ra is 46.46 nm. Other surface parameters, such as Rq, Rp-p, Rpk and Rsk, are also obtained and analysed. The implication of the smooth surface roughness of SU-8 structures to their applications is discussed in terms of transmission efficiency, the changes in friction to flowing liquid in a microchannel and the changes in the surface tension and capillary effect.

Original languageEnglish
Title of host publicationLaser Metrology and Machine Performance VII - 7th International Conference and Exhibition on Laser Metrology, Machine Tool, CMM and Robotic Performance, LAMDAMAP 2005
Publishereuspen
Pages402-411
Number of pages10
ISBN (Electronic)1861941188
Publication statusPublished - 1 Jan 2005
Event7th International Conference and Exhibition on Laser Metrology, CMM and Machine Tool Performance, LAMDAMAP 2005 - Cranfield, United Kingdom
Duration: 27 Jun 200530 Jun 2005

Conference

Conference7th International Conference and Exhibition on Laser Metrology, CMM and Machine Tool Performance, LAMDAMAP 2005
Country/TerritoryUnited Kingdom
CityCranfield
Period27/06/0530/06/05

ASJC Scopus subject areas

  • Atomic and Molecular Physics, and Optics
  • General Engineering

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