Stress Dissipation in Cucurbit[8]uril Ternary Complex Small Molecule Adhesives

Paul E. Williams, Zarah Walsh-Korb*, Samuel T. Jones, Yang Lan, Oren A. Scherman

*Corresponding author for this work

Research output: Contribution to journalArticlepeer-review

Abstract

The ability to control supramolecular and macroscopic self-assembly and disassembly holds great potential for responsive, reversible adhesives that can efficiently broker stresses accumulated between two surfaces. Here, cucurbit[8]uril is used to directly adhere two functionalized mica substrates creating surface-surface interactions that are held together through photoreversible CB[8] heteroternary complexes. Comparison of single-molecule, bulk, and macroscopic adhesion behavior give insight into cooperativity and stress dissipation in dynamic adhesive systems.

Original languageEnglish
Pages (from-to)13104-13109
Number of pages6
JournalLangmuir
Volume34
Issue number44
DOIs
Publication statusPublished - 6 Nov 2018

Bibliographical note

Funding Information:
We thank Dr E. Spigone for assistance with the MFP3D AFM system. Z.W.K is also grateful to the MRC Laboratory of Molecular Biology, Cambridge for access to their MFP3D AFM system. P.E.W. is grateful to the Atomic Weapons Establishment and the Melville Laboratory for Polymer Synthesis for financial support. O.A.S. and Z.W.K. thank the ERC Starting Investigator Grant (ASPiRe, no. 240689) for financial support. O.A.S. also acknowledges a Next Generation Fellowship provided by the Walters-Kundert Foundation. O.A.S. and S.T.J. acknowledge support from the EPSRC NanoSci-E+ grant, (CUBiHOLE, EP/H007024/1).

Publisher Copyright:
Copyright © 2018 American Chemical Society.

ASJC Scopus subject areas

  • General Materials Science
  • Condensed Matter Physics
  • Surfaces and Interfaces
  • Spectroscopy
  • Electrochemistry

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