Simultaneously printing the redistribution layer and filling of TSVs using a microengineered screen

Robert W. Kay; Gerard Cummins; Jack Hoyd-Gigg Ng; Jonathan G. Terry; Marc P. Y. Desmulliez; Anthony J. Walton

Simultaneously printing the redistribution layer and filling of TSVs using a microengineered screen

Robert W. Kay
, Gerard Cummins
, Jack Hoyd-Gigg Ng
, Jonathan G. Terry
, Marc P. Y. Desmulliez
, Anthony J. Walton

Engineering

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Original language	English
Title of host publication	2012 IEEE 14th Electronics Packaging Technology Conference (EPTC)
Publication status	Published - 2012

Publication series

Name	Proceedings of the 2012 Ieee 14th Electronics Packaging Technology Conference

Cite this

@inproceedings{7f16a6f3fef74eeb9a349c8ca9ae2d08,

title = "Simultaneously printing the redistribution layer and filling of TSVs using a microengineered screen",

author = "Kay, \{Robert W.\} and Gerard Cummins and Ng, \{Jack Hoyd-Gigg\} and Terry, \{Jonathan G.\} and Desmulliez, \{Marc P. Y.\} and Walton, \{Anthony J.\}",

year = "2012",

language = "English",

series = "Proceedings of the 2012 Ieee 14th Electronics Packaging Technology Conference",

booktitle = "2012 IEEE 14th Electronics Packaging Technology Conference (EPTC)",

}

Simultaneously printing the redistribution layer and filling of TSVs using a microengineered screen. / Kay, Robert W.; Cummins, Gerard; Ng, Jack Hoyd-Gigg et al.
2012 IEEE 14th Electronics Packaging Technology Conference (EPTC). 2012. (Proceedings of the 2012 Ieee 14th Electronics Packaging Technology Conference).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

TY - GEN

T1 - Simultaneously printing the redistribution layer and filling of TSVs using a microengineered screen

AU - Kay, Robert W.

AU - Cummins, Gerard

AU - Ng, Jack Hoyd-Gigg

AU - Terry, Jonathan G.

AU - Desmulliez, Marc P. Y.

AU - Walton, Anthony J.

PY - 2012

Y1 - 2012

M3 - Conference contribution

T3 - Proceedings of the 2012 Ieee 14th Electronics Packaging Technology Conference

BT - 2012 IEEE 14th Electronics Packaging Technology Conference (EPTC)

ER -