Simultaneously printing the redistribution layer and filling of TSVs using a microengineered screen

Robert W. Kay, Gerard Cummins, Jack Hoyd-Gigg Ng, Jonathan G. Terry, Marc P. Y. Desmulliez, Anthony J. Walton

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Original languageEnglish
Title of host publication 2012 IEEE 14th Electronics Packaging Technology Conference (EPTC)
Publication statusPublished - 2012

Publication series

NameProceedings of the 2012 Ieee 14th Electronics Packaging Technology Conference

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