Progress towards filling through silicon vias with conductive inks

Gerard Cummins; Jack Hoy-Gig Ng; Marc Phillipe Yves Desmulliez; Robert W Kay; A J Walton; J G Terry

doi:10.1109/EPTC.2012.6507170

Progress towards filling through silicon vias with conductive inks

Gerard Cummins, Jack Hoy-Gig Ng, Marc Phillipe Yves Desmulliez, Robert W Kay, A J Walton, J G Terry

Engineering

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

4 Citations (Scopus)

Abstract

Inkjet printing is a promising additive manufacturing technology that is being increasingly used in applications such as displays, electronics and electronic packaging. Through Silicon Vias (TSVs) is an important enabling technology for advanced electronic packaging. The direct write nature of inkjet printing would also allow flexible packaging solutions through the cheap and sustainable filling of vias. This paper describes the progress to date with using this printing technology to fill TSVs and some of the challenges encountered to date.

Original language	English
Title of host publication	IEEE 14th Electronics Packaging Technology Conference (EPTC), 2012
DOIs	https://doi.org/10.1109/EPTC.2012.6507170
Publication status	Published - 2012

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10.1109/EPTC.2012.6507170

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title = "Progress towards filling through silicon vias with conductive inks",

abstract = "Inkjet printing is a promising additive manufacturing technology that is being increasingly used in applications such as displays, electronics and electronic packaging. Through Silicon Vias (TSVs) is an important enabling technology for advanced electronic packaging. The direct write nature of inkjet printing would also allow flexible packaging solutions through the cheap and sustainable filling of vias. This paper describes the progress to date with using this printing technology to fill TSVs and some of the challenges encountered to date.",

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AU - Kay, Robert W

AU - Walton, A J

AU - Terry, J G

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N2 - Inkjet printing is a promising additive manufacturing technology that is being increasingly used in applications such as displays, electronics and electronic packaging. Through Silicon Vias (TSVs) is an important enabling technology for advanced electronic packaging. The direct write nature of inkjet printing would also allow flexible packaging solutions through the cheap and sustainable filling of vias. This paper describes the progress to date with using this printing technology to fill TSVs and some of the challenges encountered to date.

AB - Inkjet printing is a promising additive manufacturing technology that is being increasingly used in applications such as displays, electronics and electronic packaging. Through Silicon Vias (TSVs) is an important enabling technology for advanced electronic packaging. The direct write nature of inkjet printing would also allow flexible packaging solutions through the cheap and sustainable filling of vias. This paper describes the progress to date with using this printing technology to fill TSVs and some of the challenges encountered to date.

UR - https://pureapps2.hw.ac.uk/portal/en/publications/progress-towards-filling-through-silicon-vias-with-conductive-inks(1398115a-3a9b-49d8-8b9d-2199b601db5e).html

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DO - 10.1109/EPTC.2012.6507170

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BT - IEEE 14th Electronics Packaging Technology Conference (EPTC), 2012

ER -

Progress towards filling through silicon vias with conductive inks

Abstract

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