Progress towards filling through silicon vias with conductive inks

Gerard Cummins, Jack Hoy-Gig Ng, Marc Phillipe Yves Desmulliez, Robert W Kay, A J Walton, J G Terry

Research output: Chapter in Book/Report/Conference proceedingConference contribution

4 Citations (Scopus)


Inkjet printing is a promising additive manufacturing technology that is being increasingly used in applications such as displays, electronics and electronic packaging. Through Silicon Vias (TSVs) is an important enabling technology for advanced electronic packaging. The direct write nature of inkjet printing would also allow flexible packaging solutions through the cheap and sustainable filling of vias. This paper describes the progress to date with using this printing technology to fill TSVs and some of the challenges encountered to date.
Original languageUndefined/Unknown
Title of host publicationIEEE 14th Electronics Packaging Technology Conference (EPTC), 2012
Publication statusPublished - 2012

Cite this