Printed circuit board as a MEMS platform for focused ion beam technology

David Cheneler; J Teng; Michael Adams; Carl Anthony; Emma Carter; Michael Ward

doi:10.1016/j.mee.2010.09.017

Printed circuit board as a MEMS platform for focused ion beam technology

David Cheneler, J Teng, Michael Adams, Carl Anthony, Emma Carter, Michael Ward

Research output: Contribution to journal › Article

2 Citations (Scopus)

Abstract

By combining low-cost printed circuit board technology and focused ion beam techniques, a simple method has been developed to produce thermal microsensors in a robust package with straightforward electrical connectivity. Two devices have been developed to demonstrate the principle. The first was fabricated using a single step process comprised of FIB deposited platinum. The second device utilised a multistep process using FIB milled thermally evaporated Au on a PCB platform with through-plated vias. The performance of these devices was tested by measuring their thermo-electrical characteristics. (C) 2010 Elsevier B.V. All rights reserved.

Original language	English
Pages (from-to)	121-126
Number of pages	6
Journal	Microelectronic Engineering
Volume	88
Issue number	1
DOIs	https://doi.org/10.1016/j.mee.2010.09.017
Publication status	Published - 1 Jan 2011

Keywords

Thermal sensor
Focused ion beam
Printed circuit board

Access to Document

10.1016/j.mee.2010.09.017

Cite this

@article{1e2f834c86f4458581784cfe0beca519,

title = "Printed circuit board as a MEMS platform for focused ion beam technology",

abstract = "By combining low-cost printed circuit board technology and focused ion beam techniques, a simple method has been developed to produce thermal microsensors in a robust package with straightforward electrical connectivity. Two devices have been developed to demonstrate the principle. The first was fabricated using a single step process comprised of FIB deposited platinum. The second device utilised a multistep process using FIB milled thermally evaporated Au on a PCB platform with through-plated vias. The performance of these devices was tested by measuring their thermo-electrical characteristics. (C) 2010 Elsevier B.V. All rights reserved.",

keywords = "Thermal sensor, Focused ion beam, Printed circuit board",

author = "David Cheneler and J Teng and Michael Adams and Carl Anthony and Emma Carter and Michael Ward",

year = "2011",

month = jan,

day = "1",

doi = "10.1016/j.mee.2010.09.017",

language = "English",

volume = "88",

pages = "121--126",

journal = "Microelectronic Engineering",

issn = "1873-5568",

publisher = "Elsevier",

number = "1",

}

TY - JOUR

T1 - Printed circuit board as a MEMS platform for focused ion beam technology

AU - Cheneler, David

AU - Teng, J

AU - Adams, Michael

AU - Anthony, Carl

AU - Carter, Emma

AU - Ward, Michael

PY - 2011/1/1

Y1 - 2011/1/1

N2 - By combining low-cost printed circuit board technology and focused ion beam techniques, a simple method has been developed to produce thermal microsensors in a robust package with straightforward electrical connectivity. Two devices have been developed to demonstrate the principle. The first was fabricated using a single step process comprised of FIB deposited platinum. The second device utilised a multistep process using FIB milled thermally evaporated Au on a PCB platform with through-plated vias. The performance of these devices was tested by measuring their thermo-electrical characteristics. (C) 2010 Elsevier B.V. All rights reserved.

AB - By combining low-cost printed circuit board technology and focused ion beam techniques, a simple method has been developed to produce thermal microsensors in a robust package with straightforward electrical connectivity. Two devices have been developed to demonstrate the principle. The first was fabricated using a single step process comprised of FIB deposited platinum. The second device utilised a multistep process using FIB milled thermally evaporated Au on a PCB platform with through-plated vias. The performance of these devices was tested by measuring their thermo-electrical characteristics. (C) 2010 Elsevier B.V. All rights reserved.

KW - Thermal sensor

KW - Focused ion beam

KW - Printed circuit board

U2 - 10.1016/j.mee.2010.09.017

DO - 10.1016/j.mee.2010.09.017

M3 - Article

SN - 1873-5568

VL - 88

SP - 121

EP - 126

JO - Microelectronic Engineering

JF - Microelectronic Engineering

IS - 1

ER -

Printed circuit board as a MEMS platform for focused ion beam technology

Abstract

Keywords

Access to Document

Fingerprint

Cite this