Plastic embossing of 3D ceramic microstructures

Bo Su, Timothy Button, A Schneider, L Singleton, Philip Prewett

Research output: Contribution to journalArticle

38 Citations (Scopus)

Abstract

An embossing method based on the viscous polymer processed (VPP) ceramic tape has been used to fabricate 3D ceramic microstructures with high aspect ratios. Examples of lead zirconate titanate (PZT) microrod arrays with feature sizes of 10-150 mum and aspect ratios of 3-10 have been demonstrated. Advantages of the embossing technique over conventional casting and moulding methods are discussed.
Original languageEnglish
Pages (from-to)359-362
Number of pages4
JournalMicrosystems Technology
Volume8
DOIs
Publication statusPublished - 1 Aug 2002

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