Physical characterisation of selective stress coupline for resonant pressure sensors

Peter Kinnell, Michael Ward, R Craddock

Research output: Contribution to journalArticle


This paper presents a selective stress coupling structure for resonant sensor applications. The structure is designed to selectively couple a resonant strain gauge into strain in one degree of freedom only. It constrains the displacement of the resonator such that it always stays aligned. A resonant pressure sensor is proposed that incorporates the stress isolation chip to allow a resonant strain gauge to be mounted to a large pressure sensitive silicon diaphragm. The chip behavior has been modeled using finite element analysis. Physical testing using a Wyko non-contact surface profiler has been carried out to investigate the selective stress coupling structure performance. (C) 2004 Elsevier B.V. All rights reserved.
Original languageEnglish
JournalSensors and Actuators A: Physical
Publication statusPublished - 12 Mar 2004


  • resonant
  • stress isolation
  • pressure
  • packaging
  • strain gauge


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