Performance of a high resolution chemically amplified electron beam resist at various beam energies

  • Richard Palmer
  • , Dongxu Yang
  • , Andreas Frommhold
  • , A. McClelland
  • , J. Roth
  • , M. Rosamond
  • , E.H. Linfield
  • , J. Osmond
  • , Alexander Robinson

Research output: Contribution to journalArticlepeer-review

6 Citations (Scopus)
233 Downloads (Pure)

Abstract

A novel negative tone molecular resist molecule featuring a tert-butyloxycarbonyl protected phenol malonate group bonded to a 1,8-Diazabicycloundece-7-ene is presented. The resist shows high-resolution capability in electron beam lithography at a range of beam energies. The resist demonstrated a sensitivity of 18.7 μC/cm2 at 20 kV. Dense features with a line width of 15 nm have been demonstrated at 30 kV, whilst a feature size of 12.5 nm was achieved for dense lines at 100 kV.
Original languageEnglish
Pages (from-to)97-101
JournalMicroelectronic Engineering
Volume155
Early online date5 Mar 2016
DOIs
Publication statusPublished - 2 Apr 2016

Keywords

  • Electron beam lithography
  • Molecular resist
  • Chemically amplification
  • Electron beam energy

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