Optimization and characterisation of bonding of piezoelectric transducers using anisotropic conductive adhesive

Gerard Cummins; Jun Gao; David Watson; Marc Phillipe Yves Desmulliez; Rachael McPhillips; Sandy  Cochran

doi:10.1109/ULTSYM.2017.8092778

Optimization and characterisation of bonding of piezoelectric transducers using anisotropic conductive adhesive

Gerard Cummins, Jun Gao, David Watson, Marc Phillipe Yves Desmulliez, Rachael McPhillips, Sandy Cochran

Engineering

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

2 Citations (Scopus)

Abstract

Bonding technology using anisotropic conductive paste shows great promise to achieve the denser integration schemes that are required for the application of high resolution ultrasonic imaging. A design of experiments has been carried out to characterize and optimize a flip-chip bonding technology that utilizes a novel, magnetically aligned anisotropic conductive paste. This optimized process has the potential to implement more reliable and electrically conductive, fine pitch bonding for the production of high density ultrasound transducer arrays in needle devices.

Original language	English
Title of host publication	2017 IEEE International Ultrasonics Symposium (IUS)
Number of pages	4
DOIs	https://doi.org/10.1109/ULTSYM.2017.8092778
Publication status	Published - 2 Nov 2017
Event	2017 IEEE International Ultrasonics Symposium (IUS) - Omni Shoreham Hotel, Washington, United States Duration: 6 Sept 2017 → 9 Sept 2017 http://ewh.ieee.org/conf/ius/2017/

Publication series

Name	IEEE International Ultrasonics Symposium
Publisher	IEEE
ISSN (Print)	1948-5727
ISSN (Electronic)	1948-5719

Conference

Conference	2017 IEEE International Ultrasonics Symposium (IUS)
Country/Territory	United States
City	Washington
Period	6/09/17 → 9/09/17
Internet address	http://ewh.ieee.org/conf/ius/2017/

Keywords

anisotropic conductive adhesive
flip-chip bonding
high frequency ultrasound
design of experiments

Access to Document

10.1109/ULTSYM.2017.8092778Licence: None: All rights reserved

https://ieeexplore.ieee.org/document/8092778Licence: None: All rights reserved

Cite this

@inproceedings{17317dc6d53f40e8bbbffa27abd3cd4b,

title = "Optimization and characterisation of bonding of piezoelectric transducers using anisotropic conductive adhesive",

abstract = "Bonding technology using anisotropic conductive paste shows great promise to achieve the denser integration schemes that are required for the application of high resolution ultrasonic imaging. A design of experiments has been carried out to characterize and optimize a flip-chip bonding technology that utilizes a novel, magnetically aligned anisotropic conductive paste. This optimized process has the potential to implement more reliable and electrically conductive, fine pitch bonding for the production of high density ultrasound transducer arrays in needle devices.",

keywords = "anisotropic conductive adhesive, flip-chip bonding, high frequency ultrasound, design of experiments",

author = "Gerard Cummins and Jun Gao and David Watson and Desmulliez, {Marc Phillipe Yves} and Rachael McPhillips and Sandy Cochran",

year = "2017",

month = nov,

day = "2",

doi = "10.1109/ULTSYM.2017.8092778",

language = "English",

isbn = "9781538633830",

series = "IEEE International Ultrasonics Symposium",

publisher = "IEEE",

booktitle = "2017 IEEE International Ultrasonics Symposium (IUS)",

note = "2017 IEEE International Ultrasonics Symposium (IUS) ; Conference date: 06-09-2017 Through 09-09-2017",

url = "http://ewh.ieee.org/conf/ius/2017/",

}

Cummins, G, Gao, J, Watson, D, Desmulliez, MPY, McPhillips, R & Cochran, S 2017, Optimization and characterisation of bonding of piezoelectric transducers using anisotropic conductive adhesive. in 2017 IEEE International Ultrasonics Symposium (IUS). IEEE International Ultrasonics Symposium, 2017 IEEE International Ultrasonics Symposium (IUS), Washington, District of Columbia, United States, 6/09/17. https://doi.org/10.1109/ULTSYM.2017.8092778

TY - GEN

T1 - Optimization and characterisation of bonding of piezoelectric transducers using anisotropic conductive adhesive

AU - Cummins, Gerard

AU - Gao, Jun

AU - Watson, David

AU - Desmulliez, Marc Phillipe Yves

AU - McPhillips, Rachael

AU - Cochran, Sandy

PY - 2017/11/2

Y1 - 2017/11/2

N2 - Bonding technology using anisotropic conductive paste shows great promise to achieve the denser integration schemes that are required for the application of high resolution ultrasonic imaging. A design of experiments has been carried out to characterize and optimize a flip-chip bonding technology that utilizes a novel, magnetically aligned anisotropic conductive paste. This optimized process has the potential to implement more reliable and electrically conductive, fine pitch bonding for the production of high density ultrasound transducer arrays in needle devices.

AB - Bonding technology using anisotropic conductive paste shows great promise to achieve the denser integration schemes that are required for the application of high resolution ultrasonic imaging. A design of experiments has been carried out to characterize and optimize a flip-chip bonding technology that utilizes a novel, magnetically aligned anisotropic conductive paste. This optimized process has the potential to implement more reliable and electrically conductive, fine pitch bonding for the production of high density ultrasound transducer arrays in needle devices.

KW - anisotropic conductive adhesive

KW - flip-chip bonding

KW - high frequency ultrasound

KW - design of experiments

UR - https://researchportal.hw.ac.uk/en/publications/optimization-and-characterisation-of-bonding-of-piezoelectric-tra

UR - https://ieeexplore.ieee.org/document/8092114

U2 - 10.1109/ULTSYM.2017.8092778

DO - 10.1109/ULTSYM.2017.8092778

M3 - Conference contribution

SN - 9781538633830

T3 - IEEE International Ultrasonics Symposium

BT - 2017 IEEE International Ultrasonics Symposium (IUS)

T2 - 2017 IEEE International Ultrasonics Symposium (IUS)

Y2 - 6 September 2017 through 9 September 2017

ER -

Optimization and characterisation of bonding of piezoelectric transducers using anisotropic conductive adhesive

Abstract

Publication series

Conference

Keywords

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