Numerical simulation of heat transfer enhancement for copper foam heat sink in electronic devices using water based BN nanofluids

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Original language	English
Title of host publication	International Heat Transfer Conference
Publication status	Published - 2018

Cite this

@inproceedings{3ac1b164f9724c6299d53878deed8d2f,

title = "Numerical simulation of heat transfer enhancement for copper foam heat sink in electronic devices using water based BN nanofluids",

author = "G. Zhang and H. Cao and M.E. Navarro and J.W. Pomeroy and C. Yuan and M. Kuball and Y. Ding",

year = "2018",

language = "English",

booktitle = "International Heat Transfer Conference",

}

TY - GEN

T1 - Numerical simulation of heat transfer enhancement for copper foam heat sink in electronic devices using water based BN nanofluids

AU - Zhang, G.

AU - Cao, H.

AU - Navarro, M.E.

AU - Pomeroy, J.W.

AU - Yuan, C.

AU - Kuball, M.

AU - Ding, Y.

PY - 2018

Y1 - 2018

UR - https://www.scopus.com/pages/publications/85068333418

M3 - Conference contribution

BT - International Heat Transfer Conference

ER -