Novel low cost procedure for fabrication of diffusion bonds in Ti 6/4

A novel processing route has been developed with the aim of achieving low cost joining. To this end, the fabrication of structurally sound bonds between a similar Ti 6/4 alloy couple has been facilitated by incorporating a copper based interlayer integral to the faying surface. A Gleeble thermomechanical simulator has been employed to optimise the key bonding parameters (i.e. pressure, time, temperature and environment) together with the quantity of copper required to produce high quality bonds with near parent properties. Metallographic sections, chemical composition and microhardness traverses across the bond line are all presented as evidence of joint form and integrity. The mechanical response of the bonds was assessed under monotonic tensile loading conditions. The suitability of this novel joining technique for the fabrication of engineering components and its implications are discussed.