Novel dual layer electroformed stencils for high resolution LTCC circuit manufacture

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

2 Citations (Scopus)

Original language	English
Title of host publication	2011 IEEE 13th Electronics Packaging Technology Conference, EPTC 2011
DOIs	https://doi.org/10.1109/EPTC.2011.6184473
Publication status	Published - 2011

Access to Document

@inproceedings{a73bc8687d2249738bf7c585ec4f03bf,

title = "Novel dual layer electroformed stencils for high resolution LTCC circuit manufacture",

author = "R.W. Kay and G. Cummins and M.P.Y. Desmulliez and J. Terry and A.J. Walton",

year = "2011",

doi = "10.1109/EPTC.2011.6184473",

language = "English",

booktitle = "2011 IEEE 13th Electronics Packaging Technology Conference, EPTC 2011",

}

TY - GEN

T1 - Novel dual layer electroformed stencils for high resolution LTCC circuit manufacture

AU - Kay, R.W.

AU - Cummins, G.

AU - Desmulliez, M.P.Y.

AU - Terry, J.

AU - Walton, A.J.

PY - 2011

Y1 - 2011

UR - https://www.scopus.com/pages/publications/84860894455

U2 - 10.1109/EPTC.2011.6184473

DO - 10.1109/EPTC.2011.6184473

M3 - Conference contribution

BT - 2011 IEEE 13th Electronics Packaging Technology Conference, EPTC 2011

ER -