Abstract
Ti-6Al-4V couples have been diffusion bonded by hot isostatic pressing (HIPping) after vacuum brazing was used to seal the periphery of the bonding samples so that no encapsulation was required during HIPping. Analytical scanning electron microscopy was used to assess the microstructure of the HIPped interface and tensile and fatigue properties of bonded samples were compared with those of the bulk starting material. The tensile properties of the bonds were shown to be comparable with those of the bulk material, but the fatigue life was slightly downgraded. The fatigue fractures were initiated by inclusions on the bonding interface, caused by contamination before bonding, but the fatigue cracks did not propagate along the bonding interface indicating a strong bond. It is concluded that this technique of vacuum brazing plus HIPping could be used for encapsulation-free HIPping to produce complex-shaped components. (C) 2011 Elsevier B.V. All rights reserved.
| Original language | English |
|---|---|
| Pages (from-to) | 7388-7394 |
| Number of pages | 7 |
| Journal | Materials Science and Engineering A |
| Volume | 528 |
| Issue number | 24 |
| DOIs | |
| Publication status | Published - 1 Sept 2011 |
Keywords
- Brazing
- Hot isostatic pressing
- Encapsulation-free
- Diffusion bonding