Abstract
During flexible optoelectronic device packaging, acid containing layers initiate the functional failure of the underlying indium tin oxide film. We experimentally investigate the stress-assisted corrosion cracking of thin conductive optoelectronic components. It is essential to understand the stress corrosion mechanisms in order to design highly durable flexible electronic structures.
| Original language | English |
|---|---|
| Pages (from-to) | 1461-1464 |
| Number of pages | 4 |
| Journal | Digest of Technical Papers - SID International Symposium |
| Volume | 39 |
| Issue number | 3 |
| Publication status | Published - 30 Oct 2008 |
| Event | 2008 SID International Symposium - Los Angeles, CA, United States Duration: 20 May 2008 → 21 May 2008 |
ASJC Scopus subject areas
- General Engineering