During flexible optoelectronic device packaging, acid containing layers initiate the functional failure of the underlying indium tin oxide film. We experimentally investigate the stress-assisted corrosion cracking of thin conductive optoelectronic components. It is essential to understand the stress corrosion mechanisms in order to design highly durable flexible electronic structures.
|Number of pages||4|
|Journal||Digest of Technical Papers - SID International Symposium|
|Publication status||Published - 30 Oct 2008|
|Event||2008 SID International Symposium - Los Angeles, CA, United States|
Duration: 20 May 2008 → 21 May 2008
ASJC Scopus subject areas