Integral equation methods for the electromagnetic analysis of interconnect networks: state of the art and open challenges

Piero Triverio; Shashwat Sharma

Integral equation methods for the electromagnetic analysis of interconnect networks: state of the art and open challenges

Piero Triverio
, Shashwat Sharma

Electronic, Electrical and Systems Engineering

Research output: Contribution to conference (unpublished) › Other › peer-review

Original language	English
Publication status	Published - 12 Oct 2022
Event	2022 IEEE 31st Conference on Electrical Performance of Electronic Packaging and Systems - San Jose, United States Duration: 9 Oct 2022 → 12 Oct 2022

Conference

Conference	2022 IEEE 31st Conference on Electrical Performance of Electronic Packaging and Systems
Abbreviated title	EPEPS 2022
Country/Territory	United States
City	San Jose
Period	9/10/22 → 12/10/22

Bibliographical note

Invited tutorial.

Cite this

@conference{1ddaa6174d9e4c0392b7ed9b9713598c,

title = "Integral equation methods for the electromagnetic analysis of interconnect networks: state of the art and open challenges",

author = "Piero Triverio and Shashwat Sharma",

note = "Invited tutorial.; 2022 IEEE 31st Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2022 ; Conference date: 09-10-2022 Through 12-10-2022",

year = "2022",

month = oct,

day = "12",

language = "English",

}

Integral equation methods for the electromagnetic analysis of interconnect networks: state of the art and open challenges. / Triverio, Piero; Sharma, Shashwat.
2022. 2022 IEEE 31st Conference on Electrical Performance of Electronic Packaging and Systems, San Jose, California, United States.

Research output: Contribution to conference (unpublished) › Other › peer-review