High Reliability Pb-Free Printed Circuit Board Assembly

SDT Weller, Ian Jones, IM Fox, T Hirst

Research output: Contribution to conference (unpublished) › Paper

Original language	English
Pages	9-12
Number of pages	4
DOIs	https://doi.org/10.4028/www.scientific.net/KEM.450.9
Publication status	Published - 1 Jan 2011
Event	3rd International Conference on Advanced Design and Manufacture, Sep 08-10, 2010. Nottingham, England - Duration: 1 Jan 2011 → …

Conference	3rd International Conference on Advanced Design and Manufacture, Sep 08-10, 2010. Nottingham, England
Period	1/01/11 → …

Keywords

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title = "High Reliability Pb-Free Printed Circuit Board Assembly",

keywords = "surface finish, lead-free, solderability, thermal cycling",

author = "SDT Weller and Ian Jones and IM Fox and T Hirst",

year = "2011",

month = jan,

day = "1",

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language = "English",

pages = "9--12",

note = "3rd International Conference on Advanced Design and Manufacture, Sep 08-10, 2010. Nottingham, England ; Conference date: 01-01-2011",

}

TY - CONF

T1 - High Reliability Pb-Free Printed Circuit Board Assembly

AU - Weller, SDT

AU - Jones, Ian

AU - Fox, IM

AU - Hirst, T

PY - 2011/1/1

Y1 - 2011/1/1

KW - surface finish

KW - lead-free

KW - solderability

KW - thermal cycling

U2 - 10.4028/www.scientific.net/KEM.450.9

DO - 10.4028/www.scientific.net/KEM.450.9

M3 - Paper

SP - 9

EP - 12

T2 - 3rd International Conference on Advanced Design and Manufacture, Sep 08-10, 2010. Nottingham, England

Y2 - 1 January 2011

ER -