A interconnection method has been developed to integrate GaAs Schottky diode components with hollow metal waveguides. Instead of using wired or probe impedance matching, an integrated resonator matching circuit has been adopted and a co-design method of active components with waveguide cavity filters developed. The approach transfers most of the matching circuitry from the lossy microstrip to low loss waveguide cavities. It minimises the footprint of the transition and improves the efficiency of the interconnection. This paper reviews the design and test of several building block components for a 300 GHz communications system. A 290-310 GHz single sideband mixer incorporates an integrated waveguide filter to achieve the required image rejection and impedance matching. A 135-150 GHz frequency tripler shows good impedance matching performance with an additional built-in filtering function.
|Title of host publication||IRMMW-THz 2019 - 44th International Conference on Infrared, Millimeter, and Terahertz Waves|
|Publisher||IEEE Computer Society|
|Publication status||Published - Sept 2019|
|Event||44th International Conference on Infrared, Millimeter, and Terahertz Waves, IRMMW-THz 2019 - Paris, France|
Duration: 1 Sept 2019 → 6 Sept 2019
|Name||International Conference on Infrared, Millimeter, and Terahertz Waves, IRMMW-THz|
|Conference||44th International Conference on Infrared, Millimeter, and Terahertz Waves, IRMMW-THz 2019|
|Period||1/09/19 → 6/09/19|
Bibliographical notePublisher Copyright:
© 2019 IEEE.
Copyright 2019 Elsevier B.V., All rights reserved.
ASJC Scopus subject areas
- Energy Engineering and Power Technology
- Electrical and Electronic Engineering