GaAs Schottky Components for 300 GHz Communication Systems using a Resonator Impedance Matching Approach

Michael J. Lancaster; Cheng Guo; Jeff Powell; Hui Wang; Kai Parow-Souchon; Peter G. Huggard; Yi Wang

doi:10.1109/IRMMW-THz.2019.8874014

GaAs Schottky Components for 300 GHz Communication Systems using a Resonator Impedance Matching Approach

Michael J. Lancaster, Cheng Guo, Jeff Powell, Hui Wang, Kai Parow-Souchon, Peter G. Huggard, Yi Wang

Electronic, Electrical and Systems Engineering

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

1 Citation (Scopus)

Abstract

A interconnection method has been developed to integrate GaAs Schottky diode components with hollow metal waveguides. Instead of using wired or probe impedance matching, an integrated resonator matching circuit has been adopted and a co-design method of active components with waveguide cavity filters developed. The approach transfers most of the matching circuitry from the lossy microstrip to low loss waveguide cavities. It minimises the footprint of the transition and improves the efficiency of the interconnection. This paper reviews the design and test of several building block components for a 300 GHz communications system. A 290-310 GHz single sideband mixer incorporates an integrated waveguide filter to achieve the required image rejection and impedance matching. A 135-150 GHz frequency tripler shows good impedance matching performance with an additional built-in filtering function.

Original language	English
Title of host publication	IRMMW-THz 2019 - 44th International Conference on Infrared, Millimeter, and Terahertz Waves
Publisher	IEEE Computer Society
ISBN (Electronic)	9781538682852
DOIs	https://doi.org/10.1109/IRMMW-THz.2019.8874014
Publication status	Published - Sept 2019
Event	44th International Conference on Infrared, Millimeter, and Terahertz Waves, IRMMW-THz 2019 - Paris, France Duration: 1 Sept 2019 → 6 Sept 2019

Publication series

Name	International Conference on Infrared, Millimeter, and Terahertz Waves, IRMMW-THz
Volume	2019-September
ISSN (Print)	2162-2027
ISSN (Electronic)	2162-2035

Conference

Conference	44th International Conference on Infrared, Millimeter, and Terahertz Waves, IRMMW-THz 2019
Country/Territory	France
City	Paris
Period	1/09/19 → 6/09/19

Bibliographical note

Publisher Copyright:
© 2019 IEEE.

Copyright:
Copyright 2019 Elsevier B.V., All rights reserved.

ASJC Scopus subject areas

Energy Engineering and Power Technology
Electrical and Electronic Engineering

Access to Document

10.1109/IRMMW-THz.2019.8874014

Cite this

Lancaster, M. J., Guo, C., Powell, J., Wang, H., Parow-Souchon, K., Huggard, P. G., & Wang, Y. (2019). GaAs Schottky Components for 300 GHz Communication Systems using a Resonator Impedance Matching Approach. In IRMMW-THz 2019 - 44th International Conference on Infrared, Millimeter, and Terahertz Waves Article 8874014 (International Conference on Infrared, Millimeter, and Terahertz Waves, IRMMW-THz; Vol. 2019-September). IEEE Computer Society. https://doi.org/10.1109/IRMMW-THz.2019.8874014

Lancaster, Michael J. ; Guo, Cheng ; Powell, Jeff et al. / GaAs Schottky Components for 300 GHz Communication Systems using a Resonator Impedance Matching Approach. IRMMW-THz 2019 - 44th International Conference on Infrared, Millimeter, and Terahertz Waves. IEEE Computer Society, 2019. (International Conference on Infrared, Millimeter, and Terahertz Waves, IRMMW-THz).

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title = "GaAs Schottky Components for 300 GHz Communication Systems using a Resonator Impedance Matching Approach",

abstract = "A interconnection method has been developed to integrate GaAs Schottky diode components with hollow metal waveguides. Instead of using wired or probe impedance matching, an integrated resonator matching circuit has been adopted and a co-design method of active components with waveguide cavity filters developed. The approach transfers most of the matching circuitry from the lossy microstrip to low loss waveguide cavities. It minimises the footprint of the transition and improves the efficiency of the interconnection. This paper reviews the design and test of several building block components for a 300 GHz communications system. A 290-310 GHz single sideband mixer incorporates an integrated waveguide filter to achieve the required image rejection and impedance matching. A 135-150 GHz frequency tripler shows good impedance matching performance with an additional built-in filtering function.",

author = "Lancaster, {Michael J.} and Cheng Guo and Jeff Powell and Hui Wang and Kai Parow-Souchon and Huggard, {Peter G.} and Yi Wang",

note = "Publisher Copyright: {\textcopyright} 2019 IEEE. Copyright: Copyright 2019 Elsevier B.V., All rights reserved.; 44th International Conference on Infrared, Millimeter, and Terahertz Waves, IRMMW-THz 2019 ; Conference date: 01-09-2019 Through 06-09-2019",

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language = "English",

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Lancaster, MJ, Guo, C, Powell, J, Wang, H, Parow-Souchon, K, Huggard, PG & Wang, Y 2019, GaAs Schottky Components for 300 GHz Communication Systems using a Resonator Impedance Matching Approach. in IRMMW-THz 2019 - 44th International Conference on Infrared, Millimeter, and Terahertz Waves., 8874014, International Conference on Infrared, Millimeter, and Terahertz Waves, IRMMW-THz, vol. 2019-September, IEEE Computer Society, 44th International Conference on Infrared, Millimeter, and Terahertz Waves, IRMMW-THz 2019, Paris, France, 1/09/19. https://doi.org/10.1109/IRMMW-THz.2019.8874014

GaAs Schottky Components for 300 GHz Communication Systems using a Resonator Impedance Matching Approach. / Lancaster, Michael J.; Guo, Cheng; Powell, Jeff et al.
IRMMW-THz 2019 - 44th International Conference on Infrared, Millimeter, and Terahertz Waves. IEEE Computer Society, 2019. 8874014 (International Conference on Infrared, Millimeter, and Terahertz Waves, IRMMW-THz; Vol. 2019-September).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

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AU - Guo, Cheng

AU - Powell, Jeff

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AU - Huggard, Peter G.

AU - Wang, Yi

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AB - A interconnection method has been developed to integrate GaAs Schottky diode components with hollow metal waveguides. Instead of using wired or probe impedance matching, an integrated resonator matching circuit has been adopted and a co-design method of active components with waveguide cavity filters developed. The approach transfers most of the matching circuitry from the lossy microstrip to low loss waveguide cavities. It minimises the footprint of the transition and improves the efficiency of the interconnection. This paper reviews the design and test of several building block components for a 300 GHz communications system. A 290-310 GHz single sideband mixer incorporates an integrated waveguide filter to achieve the required image rejection and impedance matching. A 135-150 GHz frequency tripler shows good impedance matching performance with an additional built-in filtering function.

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Lancaster MJ, Guo C, Powell J, Wang H, Parow-Souchon K, Huggard PG et al. GaAs Schottky Components for 300 GHz Communication Systems using a Resonator Impedance Matching Approach. In IRMMW-THz 2019 - 44th International Conference on Infrared, Millimeter, and Terahertz Waves. IEEE Computer Society. 2019. 8874014. (International Conference on Infrared, Millimeter, and Terahertz Waves, IRMMW-THz). doi: 10.1109/IRMMW-THz.2019.8874014

GaAs Schottky Components for 300 GHz Communication Systems using a Resonator Impedance Matching Approach

Abstract

Publication series

Conference

Bibliographical note

ASJC Scopus subject areas

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Cite this