This work investigates the use of SU-8 microstructures for applications within flexible neural implants. Six different microstructures are fabricated and tested in both tension and bending to determine their Young's modulus and their failure stress when deformed about a small radius of curvature. A numerical model is presented that accurately predicts the performance of the structures under bending, and physical testing shows that stresses of up to 300 MPa are achievable. (c) 2007 Elsevier B.V. All rights reserved.
- materials testing