Evaluation of thermal aging of δ-ferrite in austenitic stainless steel weld using nanopillar compression test

Ho Jung Lee, Byeong Seo Kong, Gokul Obulan Subramanian, Jaewon Heo, Changheui Jang*, Kyoung Soo Lee

*Corresponding author for this work

Research output: Contribution to journalArticlepeer-review

11 Citations (Scopus)

Abstract

The effects of thermal aging on microstructure and mechanical property change of δ-ferrite in an austenitic stainless steel weld were investigated. After thermal aging at 400 °C for 20,000 h, spinodal decomposition and G phase precipitation were observed, along with ~80% increase in yield strength measured by nanopillar compression test. Subsequent reversion heat treatment removed spinodal decomposition while leaving G phase, resulting in partial recovery of hardening in δ-ferrite. It was estimated that ~60% of the hardening in the δ-ferrite of the aged specimen was attributed to spinodal decomposition and ~40% to G phase, respectively.

Original languageEnglish
Pages (from-to)32-36
Number of pages5
JournalScripta Materialia
Volume155
DOIs
Publication statusPublished - Oct 2018

Bibliographical note

Funding Information:
This study is mainly supported by the Korea Hydro and Nuclear Power Co., Ltd. as the Proactive Material Aging Management Project. Part of the funding is provided as Nuclear R&D Program ( 2015M2A8A2074798 ) of the MSIP/NRF of Rep. of Korea. Financial support for three of the authors is provided by the BK-Plus Program of the MSIP/NRF of Rep. of Korea.

Publisher Copyright:
© 2018 Elsevier Ltd

Keywords

  • G phase
  • Nanopillar compression test
  • Spinodal decomposition
  • Thermal aging
  • δ-Ferrites

ASJC Scopus subject areas

  • Materials Science(all)
  • Condensed Matter Physics
  • Mechanics of Materials
  • Mechanical Engineering
  • Metals and Alloys

Fingerprint

Dive into the research topics of 'Evaluation of thermal aging of δ-ferrite in austenitic stainless steel weld using nanopillar compression test'. Together they form a unique fingerprint.

Cite this