Effect of microencapsulated phase change material in sandwich panels

Cecilia Castellón, Marc Medrano, Joan Roca, Luisa F. Cabeza*, Helena Navarro, Ana Lázaro, Belen Zalba, Ana Ines Fernandez

*Corresponding author for this work

Research output: Contribution to journalArticlepeer-review

75 Citations (Scopus)

Abstract

Sandwich panels are a good option as building materials, as they offer excellent characteristics in a modular system. The goal of this study was to demonstrate the feasibility of using the microencapsulated PCM (Micronal BASF) in sandwich panels to increase their thermal inertia and to reduce the energy demand of the final buildings. In this paper, to manufacture the sandwich panel with microencapsulated PCM three different methods were tested. In case 1, the PCM was added mixing the microencapsulated PCM with one of the components of the polyurethane. In the other two cases, the PCM was added either a step before (case 2) or a step after (case 3) to the addition of the polyurethane to the metal sheets. The results show that in case 1 the effect of PCM was overlapped by a possible increase in thermal conductivity, but an increase of thermal inertia was found in case 3. In case 2, different results were obtained due to the poor distribution of the PCM. Some samples showed the effect of the PCM (higher thermal inertia), and other samples results were similar to the conventional sandwich panel. In both cases (2 and 3), it is required to industrialize the process to improve the results.

Original languageEnglish
Pages (from-to)2370-2374
Number of pages5
JournalRenewable Energy
Volume35
Issue number10
DOIs
Publication statusPublished - Oct 2010

Keywords

  • Microencapsulation
  • Phase change material (PCM)
  • Sandwich panel
  • Thermal energy storage (TES)

ASJC Scopus subject areas

  • Renewable Energy, Sustainability and the Environment

Fingerprint

Dive into the research topics of 'Effect of microencapsulated phase change material in sandwich panels'. Together they form a unique fingerprint.

Cite this