Original language | English |
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Pages (from-to) | 2175-2180 |
Journal | Surface and Coatings Technology |
Volume | 204 |
Issue number | 14 |
DOIs | |
Publication status | Published - 2010 |
Bonding mechanisms of thermally softened metallic powder particles and substrates impacted at high velocity
KeeHyun Kim, Makoto Watanabe, Seiji Kuroda
Research output: Contribution to journal › Article › peer-review
73
Citations
(Scopus)