Abstract
Polyimide (PI) and polydimethylsiloxane (PDMS) are widely used materials in biomedical sensor development. The hydrophobic property of PDMS makes it difficult to bind with other materials, such as PI, which is commonly used in sensor applications. This paper employs the chemical functionalization of the PDMS and PI surfaces via epoxy-thiol click chemistry to achieve irreversible bonding. The bonding strength between the PDMS and PI is tested using a peel-off test method where adhesive and cohesive failures are observed. To demonstrate the importance of strong bonding, a wireless pressure sensor is developed. The sensor is tested for cyclic pressures over 1 million cycles with no evidence of bonding failures. This irreversible bonding can improve sensor integrity, reliability, and stability, especially for biomedical applications.
Original language | English |
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Article number | 14 |
Number of pages | 5 |
Journal | Engineering Proceedings |
Volume | 27 |
Issue number | 1 |
DOIs | |
Publication status | Published - 1 Nov 2022 |
Event | 9th International Electronic Conference on Sensors and Applications - Online Duration: 1 Nov 2022 → 15 Nov 2022 |
Bibliographical note
Funding Information:The research leading to this publication was funded by the Science Foundation Ireland Research Professorship Award (grant no. 15/RP/2765) and the Government of Ireland Disruptive Technology Innovation Fund (grant no. DT20180031A).
Publisher Copyright:
© 2022 by the authors.
Keywords
- chemical functionalization
- irreversible bonding
- polydimethylsiloxane bonding
- polyimides bonding
- pressure sensor
- sensor development
- Proceeding Paper
ASJC Scopus subject areas
- Mechanical Engineering
- Electrical and Electronic Engineering
- Industrial and Manufacturing Engineering
- Biomedical Engineering