An optimized methodology to achieve irreversible bonding between PDMS and polyimides for biomedical sensors †

Muhammad Farooq*, Bilal Amin, Adnan Elahi, William Wijns, Atif Shahzad

*Corresponding author for this work

Research output: Contribution to journalConference articlepeer-review

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Abstract

Polyimide (PI) and polydimethylsiloxane (PDMS) are widely used materials in biomedical sensor development. The hydrophobic property of PDMS makes it difficult to bind with other materials, such as PI, which is commonly used in sensor applications. This paper employs the chemical functionalization of the PDMS and PI surfaces via epoxy-thiol click chemistry to achieve irreversible bonding. The bonding strength between the PDMS and PI is tested using a peel-off test method where adhesive and cohesive failures are observed. To demonstrate the importance of strong bonding, a wireless pressure sensor is developed. The sensor is tested for cyclic pressures over 1 million cycles with no evidence of bonding failures. This irreversible bonding can improve sensor integrity, reliability, and stability, especially for biomedical applications.

Original languageEnglish
Article number14
Number of pages5
JournalEngineering Proceedings
Volume27
Issue number1
DOIs
Publication statusPublished - 1 Nov 2022
Event9th International Electronic Conference on Sensors and Applications - Online
Duration: 1 Nov 202215 Nov 2022

Bibliographical note

Funding Information:
The research leading to this publication was funded by the Science Foundation Ireland Research Professorship Award (grant no. 15/RP/2765) and the Government of Ireland Disruptive Technology Innovation Fund (grant no. DT20180031A).

Publisher Copyright:
© 2022 by the authors.

Keywords

  • chemical functionalization
  • irreversible bonding
  • polydimethylsiloxane bonding
  • polyimides bonding
  • pressure sensor
  • sensor development
  • Proceeding Paper

ASJC Scopus subject areas

  • Mechanical Engineering
  • Electrical and Electronic Engineering
  • Industrial and Manufacturing Engineering
  • Biomedical Engineering

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