| Original language | English |
|---|---|
| Title of host publication | IEEE Conf. Electr. Perform. Electron. Packag. Syst. |
| Place of Publication | San Jose, CA |
| Publication status | Published - 1 Oct 2020 |
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An Efficient and Parallel Electromagnetic Solver for Complex Interconnects in Layered Media
- Damian Marek
- , Shashwat Sharma
- , Piero Triverio
Research output: Chapter in Book/Report/Conference proceeding › Conference contribution