A Full X-Band Fully 3-D Printed E-Plane Rectangular-Coax-to-Waveguide Transition

Jin Li; Cheng Guo; Yang Yu; Guan Long Huang; Tao Yuan; Yi Wang; Jun Xu; Anxue Zhang

doi:10.1109/mwsym.2019.8701091

A Full X-Band Fully 3-D Printed E-Plane Rectangular-Coax-to-Waveguide Transition

Jin Li, Cheng Guo, Yang Yu, Guan Long Huang, Tao Yuan, Yi Wang, Jun Xu, Anxue Zhang

Electronic, Electrical and Systems Engineering

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

2 Citations (Scopus)

Abstract

This paper reports on a new class of broadband fully 3-D printed E-plane rectangular-coax-to-waveguide transition. This type of transition is adopted to interconnect two E-plane rectangular waveguides, and is based on a full air-filled waveguide structure without introducing other types of transmission lines (TLs). It exhibits little dielectric loss and dispersion, and furthermore a potentially enhanced power handling capability. The transition is constructed by a section of air-filled rectangular coaxial TL cascaded in series to a broadband coax-to-waveguide probe transition. A proof-of-concept X-band back-to-back transition is designed and prototyped monolithically by incorporating stereolithography-based 3-D printing and copper electroplating techniques. The RF-measured result demonstrates a broadband and low-loss characteristic of the transition - an insertion loss of averagely 0.5 dB and a return loss of mostly better than 15 dB at the entire X band.

Original language	English
Title of host publication	2019 IEEE MTT-S International Microwave Symposium, IMS 2019
Publisher	Institute of Electrical and Electronics Engineers (IEEE)
Pages	1209-1212
Number of pages	4
ISBN (Electronic)	9781728113098
DOIs	https://doi.org/10.1109/mwsym.2019.8701091
Publication status	Published - Jun 2019
Event	2019 IEEE MTT-S International Microwave Symposium, IMS 2019 - Boston, United States Duration: 2 Jun 2019 → 7 Jun 2019

Publication series

Name	IEEE MTT-S International Microwave Symposium Digest
Volume	2019-June
ISSN (Print)	0149-645X

Conference

Conference	2019 IEEE MTT-S International Microwave Symposium, IMS 2019
Country/Territory	United States
City	Boston
Period	2/06/19 → 7/06/19

Bibliographical note

Funding Information:
This work was supported in part by the National Natural Science Foundation of China under Grant No. 61801300, in part by the State Key Laboratory of Millimeter Waves under Grant No. K201932, and in part by the New Teacher Natural Science Research Project of Shenzhen University under Grant No. 2018078.

Publisher Copyright:
© 2019 IEEE.

Copyright:
Copyright 2020 Elsevier B.V., All rights reserved.

Keywords

3-D printed
Air-filled transmission line
broadband
coax-to-waveguide transition
E-plane
rectangular coaxial line
stereolithography
waveguide

ASJC Scopus subject areas

Radiation
Condensed Matter Physics
Electrical and Electronic Engineering

Access to Document

10.1109/mwsym.2019.8701091

Cite this

Li, J., Guo, C., Yu, Y., Huang, G. L., Yuan, T., Wang, Y., Xu, J., & Zhang, A. (2019). A Full X-Band Fully 3-D Printed E-Plane Rectangular-Coax-to-Waveguide Transition. In 2019 IEEE MTT-S International Microwave Symposium, IMS 2019 (pp. 1209-1212). Article 8701091 (IEEE MTT-S International Microwave Symposium Digest; Vol. 2019-June). Institute of Electrical and Electronics Engineers (IEEE). https://doi.org/10.1109/mwsym.2019.8701091

@inproceedings{6b07d3987b374d71bc15a24b1e147894,

title = "A Full X-Band Fully 3-D Printed E-Plane Rectangular-Coax-to-Waveguide Transition",

abstract = "This paper reports on a new class of broadband fully 3-D printed E-plane rectangular-coax-to-waveguide transition. This type of transition is adopted to interconnect two E-plane rectangular waveguides, and is based on a full air-filled waveguide structure without introducing other types of transmission lines (TLs). It exhibits little dielectric loss and dispersion, and furthermore a potentially enhanced power handling capability. The transition is constructed by a section of air-filled rectangular coaxial TL cascaded in series to a broadband coax-to-waveguide probe transition. A proof-of-concept X-band back-to-back transition is designed and prototyped monolithically by incorporating stereolithography-based 3-D printing and copper electroplating techniques. The RF-measured result demonstrates a broadband and low-loss characteristic of the transition - an insertion loss of averagely 0.5 dB and a return loss of mostly better than 15 dB at the entire X band.",

keywords = "3-D printed, Air-filled transmission line, broadband, coax-to-waveguide transition, E-plane, rectangular coaxial line, stereolithography, waveguide",

author = "Jin Li and Cheng Guo and Yang Yu and Huang, {Guan Long} and Tao Yuan and Yi Wang and Jun Xu and Anxue Zhang",

note = "Funding Information: This work was supported in part by the National Natural Science Foundation of China under Grant No. 61801300, in part by the State Key Laboratory of Millimeter Waves under Grant No. K201932, and in part by the New Teacher Natural Science Research Project of Shenzhen University under Grant No. 2018078. Publisher Copyright: {\textcopyright} 2019 IEEE. Copyright: Copyright 2020 Elsevier B.V., All rights reserved.; 2019 IEEE MTT-S International Microwave Symposium, IMS 2019 ; Conference date: 02-06-2019 Through 07-06-2019",

year = "2019",

month = jun,

doi = "10.1109/mwsym.2019.8701091",

language = "English",

series = "IEEE MTT-S International Microwave Symposium Digest",

publisher = "Institute of Electrical and Electronics Engineers (IEEE)",

pages = "1209--1212",

booktitle = "2019 IEEE MTT-S International Microwave Symposium, IMS 2019",

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Li, J, Guo, C, Yu, Y, Huang, GL, Yuan, T, Wang, Y, Xu, J & Zhang, A 2019, A Full X-Band Fully 3-D Printed E-Plane Rectangular-Coax-to-Waveguide Transition. in 2019 IEEE MTT-S International Microwave Symposium, IMS 2019., 8701091, IEEE MTT-S International Microwave Symposium Digest, vol. 2019-June, Institute of Electrical and Electronics Engineers (IEEE), pp. 1209-1212, 2019 IEEE MTT-S International Microwave Symposium, IMS 2019, Boston, United States, 2/06/19. https://doi.org/10.1109/mwsym.2019.8701091

A Full X-Band Fully 3-D Printed E-Plane Rectangular-Coax-to-Waveguide Transition. / Li, Jin; Guo, Cheng; Yu, Yang et al.
2019 IEEE MTT-S International Microwave Symposium, IMS 2019. Institute of Electrical and Electronics Engineers (IEEE), 2019. p. 1209-1212 8701091 (IEEE MTT-S International Microwave Symposium Digest; Vol. 2019-June).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

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AU - Yuan, Tao

AU - Wang, Yi

AU - Xu, Jun

AU - Zhang, Anxue

N1 - Funding Information: This work was supported in part by the National Natural Science Foundation of China under Grant No. 61801300, in part by the State Key Laboratory of Millimeter Waves under Grant No. K201932, and in part by the New Teacher Natural Science Research Project of Shenzhen University under Grant No. 2018078. Publisher Copyright: © 2019 IEEE. Copyright: Copyright 2020 Elsevier B.V., All rights reserved.

PY - 2019/6

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N2 - This paper reports on a new class of broadband fully 3-D printed E-plane rectangular-coax-to-waveguide transition. This type of transition is adopted to interconnect two E-plane rectangular waveguides, and is based on a full air-filled waveguide structure without introducing other types of transmission lines (TLs). It exhibits little dielectric loss and dispersion, and furthermore a potentially enhanced power handling capability. The transition is constructed by a section of air-filled rectangular coaxial TL cascaded in series to a broadband coax-to-waveguide probe transition. A proof-of-concept X-band back-to-back transition is designed and prototyped monolithically by incorporating stereolithography-based 3-D printing and copper electroplating techniques. The RF-measured result demonstrates a broadband and low-loss characteristic of the transition - an insertion loss of averagely 0.5 dB and a return loss of mostly better than 15 dB at the entire X band.

AB - This paper reports on a new class of broadband fully 3-D printed E-plane rectangular-coax-to-waveguide transition. This type of transition is adopted to interconnect two E-plane rectangular waveguides, and is based on a full air-filled waveguide structure without introducing other types of transmission lines (TLs). It exhibits little dielectric loss and dispersion, and furthermore a potentially enhanced power handling capability. The transition is constructed by a section of air-filled rectangular coaxial TL cascaded in series to a broadband coax-to-waveguide probe transition. A proof-of-concept X-band back-to-back transition is designed and prototyped monolithically by incorporating stereolithography-based 3-D printing and copper electroplating techniques. The RF-measured result demonstrates a broadband and low-loss characteristic of the transition - an insertion loss of averagely 0.5 dB and a return loss of mostly better than 15 dB at the entire X band.

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KW - E-plane

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KW - stereolithography

KW - waveguide

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M3 - Conference contribution

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T3 - IEEE MTT-S International Microwave Symposium Digest

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PB - Institute of Electrical and Electronics Engineers (IEEE)

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ER -

Li J, Guo C, Yu Y, Huang GL, Yuan T, Wang Y et al. A Full X-Band Fully 3-D Printed E-Plane Rectangular-Coax-to-Waveguide Transition. In 2019 IEEE MTT-S International Microwave Symposium, IMS 2019. Institute of Electrical and Electronics Engineers (IEEE). 2019. p. 1209-1212. 8701091. (IEEE MTT-S International Microwave Symposium Digest). doi: 10.1109/mwsym.2019.8701091

A Full X-Band Fully 3-D Printed E-Plane Rectangular-Coax-to-Waveguide Transition

Abstract

Publication series

Conference

Bibliographical note

Keywords

ASJC Scopus subject areas

Access to Document

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Cite this