| Original language | English |
|---|---|
| Journal | Journal of Electronic Packaging, Transactions of the ASME |
| DOIs | |
| Publication status | Published - 16 Dec 2013 |
A Compact Modeling Approach to Enhance Collaborative Design of Thermal-Fluid Systems
Jason Stafford, D Newport, R Grimes
Research output: Contribution to journal › Article › peer-review
4
Citations
(Scopus)